參數(shù)資料
型號: AM45DL3208GB85IS
廠商: ADVANCED MICRO DEVICES INC
元件分類: 存儲(chǔ)器
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA73
封裝: 8 X 11.60 MM, FBGA-73
文件頁數(shù): 46/66頁
文件大小: 1196K
代理商: AM45DL3208GB85IS
44
Am45DL3208G
March 12, 2004
P R E L I M I N A R Y
FLASH AC CHARACTERISTICS
Hardware Reset (RESET#)
Note:
Not 100% tested.
Parameter
Description
All Speed Options
Unit
JEDEC
Std
t
Ready
RESET# Pin Low (During Embedded Algorithms)
to Read Mode (See Note)
Max
20
μ
s
t
Ready
RESET# Pin Low (NOT During Embedded
Algorithms) to Read Mode (See Note)
Max
500
ns
t
RP
RESET# Pulse Width
Min
500
ns
t
RH
Reset High Time Before Read (See Note)
Min
50
ns
t
RPD
RESET# Low to Standby Mode
Min
20
μ
s
t
RB
RY/BY# Recovery Time
Min
0
ns
RESET#
RY/BY#
RY/BY#
t
RP
t
Ready
Reset Timings NOT during Embedded Algorithms
t
Ready
CE#f, OE#
t
RH
CE#f, OE#
Reset Timings during Embedded Algorithms
RESET#
t
RP
t
RB
Figure 16.
Reset Timings
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM45DL3208GB85IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT70IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT70IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT85IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT85IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM