參數(shù)資料
型號(hào)： AM42BDS640AGBC8IS
廠商： SPANSION LLC
元件分類： 存儲(chǔ)器
英文描述： Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述： SPECIALTY MEMORY CIRCUIT, PBGA93
封裝： 8 X 11.60 MM, FBGA-93
文件頁(yè)數(shù)： 60/72頁(yè)
文件大?。?/td> 1064K
代理商： AM42BDS640AGBC8IS
62
Am42BDS640AG
November 1, 2002
P R E L I M INARY
AC CHARACTERISTICS
Note: Breakpoints in waveforms indicate that system may alternately read array data from the “non-busy bank” while checking
the status of the program or erase operation in the “busy” bank. The system should read status twice to ensure valid information.
Figure 33.
Back-to-Back Read/Write Cycle Timings
OE#
CE#f
WE#
tOEH
Data
Addresses
AVD#
PD/30h
AAh
RA
PA/SA
tWC
tDS
tDH
tRC
tOE
tAS
tAH
tACC
tOEH
tWP
tGHWL
tOEZ
tWC
tSR/W
Last Cycle in
Program or
Sector Erase
Command Sequence
Read status (at least two cycles) in same bank
and/or array data from other bank
Begin another
write or program
command sequence
RD
RA
555h
RD
tWPH
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM42BDS640AGBC8IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only, Simultaneous Operation, Burst Mode Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM
AM42BDS640AGBC9IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBC9IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBD8IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBD8IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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