參數(shù)資料
型號(hào)： AM42BDS640AGBC8IS
廠商： SPANSION LLC
元件分類： 存儲(chǔ)器
英文描述： Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述： SPECIALTY MEMORY CIRCUIT, PBGA93
封裝： 8 X 11.60 MM, FBGA-93
文件頁(yè)數(shù)： 59/72頁(yè)
文件大小： 1064K
代理商： AM42BDS640AGBC8IS
November 1, 2002
Am42BDS640AG
61
P R E L I M INARY
AC CHARACTERISTICS
Wait State Decoding Addresses:
A14, A13, A12 = “101”
5 programmed, 7 total
A14, A13, A12 = “100”
4 programmed, 6 total
A14, A13, A12 = “011”
3 programmed, 5 total
A14, A13, A12 = “010”
2 programmed, 4 total
A14, A13, A12 = “001”
1 programmed, 3 total
A14, A13, A12 = “000”
0 programmed, 2 total
Note: Figure assumes address D0 is not at an address boundary, active clock edge is rising, and wait state is set to “101”.
Figure 32.
Example of Wait States Insertion (Standard Handshaking Device)
Data
AVD#
OE#
CLK
12
3
4
5
D0
D1
01
6
2
7
3
total number of clock cycles
following AVD# falling edge
Rising edge of next clock cycle
following last wait state triggers
next burst data
number of clock cycles
programmed
45
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM42BDS640AGBC8IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only, Simultaneous Operation, Burst Mode Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM
AM42BDS640AGBC9IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBC9IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBD8IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBD8IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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