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| 型號： | AM29PDL310G83WSIN |
| 廠商： | Spansion Inc. |
| 英文描述： | 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory with Enhanced VersatileIO Control |
| 中文描述： | 64兆位（4個M x 16位），3.0伏的CMOS只，同步讀/寫閃存與增強VersatileIO控制記憶 |
| 文件頁數(shù)： | 57/61頁 |
| 文件大小： | 1653K |
| 代理商： | AM29PDL310G83WSIN |
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56
Am29PDL640G
February 26, 2003
P R E L I M I N A R Y
PHYSICAL DIMENSIONS
FBE080—80-Ball Fine-pitch Ball Grid Array 12 x 11 mm package
D
A
A2
eD
D1
E1
SE
SD
eE
0.20 (4X)
A
A1 CORNER INDEX MARK
A1 CORNER
A1
SEATING PLANE
10
6
7
7
TOP VIEW
SIDE VIEW
BOTTOM VIEW
E
B
Z
Z
0.08
Z
0.25
Z
Z A B
φ
0.08
φ
0.15
M
M
NXOb
A
B
C
D
E
F
G
H
J
K
L
M
7
6
5
4
3
2
1
8
A3-A6, B3-B6,
L3-L6, M3-M6
N/A
10.95 mm x 11.95 mm
PACKAGE
NOM.
---
---
---
11.95 BSC.
FBE 080
1.20
---
0.94
MAX.
10.95 BSC.
8.80 BSC.
5.60 BSC.
12
---
MIN.
0.84
0.20
8
80
0.30
0.35
0.40 BSC.
E
0.25
0.80 BSC.
ME
N
D
E
JEDEC
PACKAGE
SYMBOL
A
A1
A2
MD
D1
E1
b
e
NOTE
PACKAGE OUTLINE TYPE
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL FOOTPRINT
BALL FOOTPRINT
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
BODY SIZE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
OVERALL THICKNESS
BALL DIAMETER
ROW MATRIX SIZE D DIRECTION
SD / SE
3150\38.9G
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE
IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF SOLDER
BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM Z.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER
OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D
OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" IN THE PACKAGE DRAWING INDICATES THE THEORETICAL
CENTER OF DEPOPULATED BALLS.
9
FOR PACKAGE THICKNESS, "A" IS THE CONTROLLING DIMENSION.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, INK MARK,
METALLIZED MARKINGS INDENTION OR OTHER MEANS.
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