參數(shù)資料
型號: AM29F200BT-90DTE1
英文描述: 75V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRFS3207ZPBF with Standard Packaging
中文描述: EEPROM的
文件頁數(shù): 36/39頁
文件大?。?/td> 728K
代理商: AM29F200BT-90DTE1
36
Am29F002B/Am29F002NB
PHYSICAL DIMENSIONS
PD 032—32-Pin Plastic DIP
Dwg rev AD; 10/99
相關(guān)PDF資料
PDF描述
AM29F200BT-90DTI1 100V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; Similar to IRFB4310 with Lead Free Packaging
AM29F200BT-90DWC1 100V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF3710 with Standard Packaging
AM29F200BT-90DWE1 20V Single N-Channel HEXFET Power MOSFET in a I-Pak package; A IRLU3715Z with Standard Packaging
AM29F200BT-90DWI1 EEPROM
AM29F200BT-90EC 30V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRL2703S with Lead Free Packaging
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM29F200BT-90SC 制造商:Advanced Micro Devices 功能描述:
AM29F200BT-90SI 制造商:Spansion 功能描述:NOR Flash Parallel 5V 2Mbit 256K/128K x 8bit/16bit 90ns 44-Pin SO
AM29F200BT-90SI\\T 制造商:Spansion 功能描述:AM29F200BT-90SI\\T - Tape and Reel
AM29F200BT-90SI\T 制造商:Spansion 功能描述:AM29F200BT-90SI\T - Tape and Reel
AM29F400AB-120DGC1 制造商:Spansion 功能描述:4M FLASH KNOWN GOOD DIE W/ TOP BOOT (COMMERCIAL TEMP) - Gel-pak, waffle pack, wafer, diced wafer on film