2-78 Revision 17 Table 2-103 RAM512X18 Commercial-Case Conditions: T
參數(shù)資料
型號(hào): AGLN250V2-CSG81I
廠商: Microsemi SoC
文件頁數(shù): 145/150頁
文件大?。?/td> 0K
描述: IC FPGA NANO 1KB 250K 81-CSP
標(biāo)準(zhǔn)包裝: 640
系列: IGLOO nano
邏輯元件/單元數(shù): 6144
RAM 位總計(jì): 36864
輸入/輸出數(shù): 60
門數(shù): 250000
電源電壓: 1.14 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 81-WFBGA,CSBGA
供應(yīng)商設(shè)備封裝: 81-CSP(5x5)
IGLOO nano DC and Switching Characteristics
2-78
Revision 17
Table 2-103 RAM512X18
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
Std. Units
tAS
Address setup time
0.69
ns
tAH
Address hold time
0.13
ns
tENS
REN, WEN setup time
0.61
ns
tENH
REN, WEN hold time
0.07
ns
tDS
Input data (WD) setup time
0.59
ns
tDH
Input data (WD) hold time
0.30
ns
tCKQ1
Clock HIGH to new data valid on RD (output retained)
3.51
ns
tCKQ2
Clock HIGH to new data valid on RD (pipelined)
1.43
ns
tC2CRWH1
Address collision clk-to-clk delay for reliable read access after write on same address;
applicable to opening edge
0.35
ns
tC2CWRH1
Address collision clk-to-clk delay for reliable write access after read on same address;
applicable to opening edge
0.42
ns
tRSTBQ
RESET Low to data out Low on RD (flow-through)
1.72
ns
RESET Low to data out Low on RD (pipelined)
1.72
ns
tREMRSTB
RESET removal
0.51 0.51
tRECRSTB
RESET recovery
2.68
ns
tMPWRSTB RESET minimum pulse width
0.68
ns
tCYC
Clock cycle time
6.24
ns
FMAX
Maximum frequency
160 MHz
Notes:
1. For more information, refer to the application note Simultaneous Read-Write Operations in Dual-Port SRAM for Flash-
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
相關(guān)PDF資料
PDF描述
BR93L76RFVT-WE2 IC EEPROM 8KBIT 2MHZ 8TSSOP
AGLN250V2-ZCSG81I IC FPGA NANO 1KB 250K 81-CSP
A40MX02-FPLG68 IC FPGA MX SGL CHIP 3K 68-PLCC
A40MX02-FPL68 IC FPGA MX SGL CHIP 3K 68-PLCC
BR25S640F-WE2 IC EEPROM SPI 64KB 20MHZ 8-SOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGLN250V2-DIELOT 制造商:Microsemi Corporation 功能描述:AGLN250V2-DIELOT - Gel-pak, waffle pack, wafer, diced wafer on film 制造商:Microsemi SOC Products Group 功能描述:AGLN250V2-DIELOT - Gel-pak, waffle pack, wafer, diced wafer on film
AGLN250V2-QNG100I 制造商:Microsemi Corporation 功能描述:FPGA IGLOO NANO FAMILY 250K GATES 130NM (CMOS) TECHNOLOGY 1. - Trays
AGLN250V2-VQ100 功能描述:IC FPGA NANO 1KB 250K 100VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLN250V2-VQ100I 功能描述:IC FPGA NANO 1KB 250K 100VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLN250V2-VQG100 功能描述:IC FPGA 250K 1.2-1.5V 100VTQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計(jì):221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA(23x23) 其它名稱:220-1241