Revision 17 5-7 Revision 1 (cont’d) The "QN48" pin diagram was revised. 4-16 Packaging Advance v0.2
參數(shù)資料
型號: AGLN125V5-ZVQG100I
廠商: Microsemi SoC
文件頁數(shù): 54/150頁
文件大小: 0K
描述: IC FPGA NANO 1KB 125K 100VQFP
標準包裝: 90
系列: IGLOO nano
邏輯元件/單元數(shù): 3072
RAM 位總計: 36864
輸入/輸出數(shù): 71
門數(shù): 125000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 100-TQFP
供應商設備封裝: 100-VQFP(14x14)
IGLOO nano Low Power Flash FPGAs
Revision 17
5-7
Revision 1 (cont’d)
The "QN48" pin diagram was revised.
Packaging Advance
v0.2
Note 2 for the "QN48", "QN68", and "100-Pin QFN" pin diagrams was changed to
"The die attach paddle of the package is tied to ground (GND)."
The "VQ100" pin diagram was revised to move the pin IDs to the upper left corner
instead of the upper right corner.
Revision 0 (Oct 2008)
Product Brief Advance
v0.2
The following tables and sections were updated to add the UC81 and CS81
packages for AGL030:
N/A
The "I/Os Per Package" table was updated to add the following information to
table note 4: "For nano devices, the VQ100 package is offered in both leaded and
RoHS-compliant versions. All other packages are RoHS-compliant only."
updated to remove QN100 for AGLN250.
The device architecture figures, Figure 1-3 IGLOO Device Architecture Overview
through
The "PLL and CCC" section was revised to include information about CCC-GLs in
AGLN020 and smaller devices.
The "I/Os with Advanced I/O Standards" section was revised to add information
about IGLOO nano devices supporting double-data-rate applications.
Revision / Version
Changes
Page
相關PDF資料
PDF描述
AGLN125V5-VQ100I IC FPGA NANO 1KB 125K 100VQFP
AMC28DRXH CONN EDGECARD 56POS .100 DIP SLD
ABC60DRTS CONN EDGECARD 120PS .100 DIP SLD
AGLN125V5-ZVQ100I IC FPGA NANO 1KB 125K 100VQFP
ACB70DHFT CONN EDGECARD 140POS .050 SMD
相關代理商/技術參數(shù)
參數(shù)描述
AGLN250V2-CSG81 功能描述:IC FPGA 250K 1.2-1.5V CSP81 RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標準包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計:226304 輸入/輸出數(shù):131 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應商設備封裝:208-PQFP(28x28)
AGLN250V2-CSG81I 功能描述:IC FPGA NANO 1KB 250K 81-CSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
AGLN250V2-DIELOT 制造商:Microsemi Corporation 功能描述:AGLN250V2-DIELOT - Gel-pak, waffle pack, wafer, diced wafer on film 制造商:Microsemi SOC Products Group 功能描述:AGLN250V2-DIELOT - Gel-pak, waffle pack, wafer, diced wafer on film
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AGLN250V2-VQ100 功能描述:IC FPGA NANO 1KB 250K 100VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)