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鍙冩暩(sh霉)璩囨枡
| 鍨嬭櫉(h脿o)锛� | AGL125V2-FG144I |
| 寤犲晢锛� | Microsemi SoC |
| 鏂囦欢闋佹暩(sh霉)锛� | 248/250闋� |
| 鏂囦欢澶�?銆�?/td> | 0K |
| 鎻忚堪锛� | IC FPGA 1KB FLASH 125K 144FBGA |
| 妯�(bi膩o)婧�(zh菙n)鍖呰锛� | 160 |
| 绯诲垪锛� | IGLOO |
| 閭忚集鍏冧欢/鍠厓鏁�(sh霉)锛� | 3072 |
| RAM 浣嶇附瑷�(j矛)锛� | 36864 |
| 杓稿叆/杓稿嚭鏁�(sh霉)锛� | 97 |
| 闁€鏁�(sh霉)锛� | 125000 |
| 闆绘簮闆诲锛� | 1.14 V ~ 1.575 V |
| 瀹夎椤炲瀷锛� | 琛ㄩ潰璨艰 |
| 宸ヤ綔婧害锛� | -40°C ~ 85°C |
| 灏佽/澶栨锛� | 144-LBGA |
| 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 | 144-FPBGA锛�13x13锛� |
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IGLOO Low Power Flash FPGAs
Revision 23
2-81
B-LVDS/M-LVDS
Bus LVDS (B-LVDS) and Multipoint LVDS (M-LVDS) specifications extend the existing LVDS standard to
high-performance multipoint bus applications. Multidrop and multipoint bus configurations may contain
any combination of drivers, receivers, and transceivers. Microsemi LVDS drivers provide the higher drive
current required by B-LVDS and M-LVDS to accommodate the loading. The drivers require series
terminations for better signal quality and to control voltage swing. Termination is also required at both
ends of the bus since the driver can be located anywhere on the bus. These configurations can be
implemented using the TRIBUF_LVDS and BIBUF_LVDS macros along with appropriate terminations.
Multipoint designs using Microsemi LVDS macros can achieve up to 200 MHz with a maximum of 20
loads. A sample application is given in Figure 2-14. The input and output buffer delays are available in
the LVDS section in Table 2-149 on page 2-80 and Table 2-150 on page 2-80.
Example: For a bus consisting of 20 equidistant loads, the following terminations provide the required
differential voltage, in worst-case Industrial operating conditions, at the farthest receiver: RS =60 and
RT =70 , given Z0 =50 (2") and Zstub =50 (~1.5").
LVPECL
Low-Voltage Positive Emitter-Coupled Logic (LVPECL) is another differential I/O standard. It requires
that one data bit be carried through two signal lines. Like LVDS, two pins are needed. It also requires
external resistor termination.
The full implementation of the LVDS transmitter and receiver is shown in an example in Figure 2-15. The
building blocks of the LVPECL transmitter-receiver are one transmitter macro, one receiver macro, three
board resistors at the transmitter end, and one resistor at the receiver end. The values for the three driver
resistors are different from those used in the LVDS implementation because the output standard
specifications are different.
Figure 2-14 B-LVDS/M-LVDS Multipoint Application Using LVDS I/O Buffers
...
RT
BIBUF_LVDS
R
+
-
T
+
-
R
+
-
T
+
-
D
+
-
EN
Receiver
Transceiver
Receiver
Transceiver
Driver
RS RS
Zstub
Z0
Figure 2-15 LVPECL Circuit Diagram and Board-Level Implementation
187 W
100
Z0 = 50
100
100
+
鈥�
P
N
P
N
INBUF_LVPECL
OUTBUF_LVPECL
FPGA
Bourns Part Number: CAT16-PC4F12
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鍙冩暩(sh霉)鎻忚堪 |
|---|---|
| AGL125V2-FG144T | 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:AGL125V2-FG144T - Trays 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:IC FPGA 97 I/O 144FBGA 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:IC FPGA 125K GATES 144FBGA |
| AGL125V2-FGG144 | 鍔熻兘鎻忚堪:IC FPGA IGLOO 1.2-1.5V 144FPBGA RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄ｅ垪锛� 绯诲垪:IGLOO 妯�(bi膩o)婧�(zh菙n)鍖呰:24 绯诲垪:ECP2 LAB/CLB鏁�(sh霉):1500 閭忚集鍏冧欢/鍠厓鏁�(sh霉):12000 RAM 浣嶇附瑷�(j矛):226304 杓稿叆/杓稿嚭鏁�(sh霉):131 闁€鏁�(sh霉):- 闆绘簮闆诲:1.14 V ~ 1.26 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 85°C 灏佽/澶栨:208-BFQFP 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:208-PQFP锛�28x28锛� |
| AGL125V2-FGG144I | 鍔熻兘鎻忚堪:IC FPGA 1KB FLASH 125K 144FBGA RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄ｅ垪锛� 绯诲垪:IGLOO 妯�(bi膩o)婧�(zh菙n)鍖呰:152 绯诲垪:IGLOO PLUS LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):792 RAM 浣嶇附瑷�(j矛):- 杓稿叆/杓稿嚭鏁�(sh霉):120 闁€鏁�(sh霉):30000 闆绘簮闆诲:1.14 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 85°C 灏佽/澶栨:289-TFBGA锛孋SBGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:289-CSP锛�14x14锛� |
| AGL125V2-FGG144T | 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:AGL125V2-FGG144T - Trays |
| AGL125V2-FQN144 | 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:IGLOO Low-Power Flash FPGAs with Flash Freeze Technology |
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