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參數(shù)資料
| 型號： | ADV7441ABSTZ-5P |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 2/28頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DECODER DIGITIZER 144LQFP |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | Advantiv® |
| 類型： | 視頻解碼器 |
| 應(yīng)用： | HDTV，投影儀，機(jī)頂盒 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 144-LQFP |
| 供應(yīng)商設(shè)備封裝： | 144-LQFP（20x20） |
| 包裝： | 托盤 |
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ADV7441A
Data Sheet
Rev. H | Page 10 of 28
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
AVDD to AGND
2.2 V
DVDD to DGND
2.2 V
PVDD to PGND
2.2 V
DVDDIO to DGND
4 V
CVDD to CGND
2.2 V
TVDD to TGND
4 V
DVDDIO to AVDD
0.3 V to +3.6 V
DVDDIO to TVDD
3.6 V to +3.6 V
DVDDIO to DVDD
2 V to +2 V
CVDD to DVDD
2 V to +0.3 V
PVDD to DVDD
2 V to +0.3 V
AVDD to CVDD
2 V to +2 V
AVDD to PVDD
2 V to +2 V
AVDD to DVDD
2 V to +0.3 V
AVDD to TVDD
3.6 V to +0.3 V
TVDD to DVDD
2 V to +2 V
Digital Inputs
Voltage to DGND
DGND 0.3 V to DVDDIO + 0.3 V
Digital Outputs
Voltage to DGND
DGND 0.3 V to DVDDIO + 0.3 V
Analog Inputs
Voltage to AGND
AGND 0.3 V to AVDD + 0.3 V
Maximum Junction
Temperature (TJ_MAX)
119°C
Storage Temperature Range
65°C to +150°C
Infrared Reflow,
Soldering (20 sec)
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 6.
Package Type
ΨJT1
Unit
144-Lead LQFP (ST-144)
1.62
°C/W
1
Junction-to-package surface thermal resistance.
PACKAGE THERMAL PERFORMANCE
To reduce power consumption during ADV7441A operation,
turn off unused ADCs.
On a 4-layer PCB that includes a solid ground plane, the value
of θJA is 25.3°C/W. However, due to variations within the PCB
metal and, therefore, variations in PCB heat conductivity, the
value of θJA may differ for various PCBs.
The most efficient measurement technique is to use the surface
temperature of the package to estimate the die temperature
because it is not affected by the variance associated with the
value of θJA.
The maximum junction temperature (TJ_MAX) of 119°C must not
be exceeded. The following equation calculates the junction
temperature using the measured surface temperature of the
package and applies only when no heat sink is used on the
device under test:
TJ_MAX = TS + (ΨJT × WTOTAL)
where:
TS is the surface temperature of the package expressed in degrees
Celsius.
ΨJT is the junction-to-package surface thermal resistance.
WTOTAL = {(AVDD × IAVDD) + (DVDD × IDVDD) + (DVDDIO ×
IDVDDIO) + (PVDD × IPVDD) + (CVDD × ICVDD) + (TVDD × ITVDD)}.
The ADV7441A can be operated in ambient temperatures of
up to +85°C. However, in video modes where highest power
is consumed and there is higher than nominal power supply
voltages and worst-case video data, operation at these ambient
temperatures may cause the junction temperature to exceed its
maximum allowed value (119°C). One way to avoid this is to
restrict the ambient temperature to be below +79°C. However, even
if the ambient temperature is kept below +79°C, the user still needs
to observe the thermally efficient PCB design recommendations
outlined in this section to ensure that the maximum allowed
junction temperature is not exceeded in any video mode.
Contact an Analog Devices, Inc., sales representative or a field
applications engineer (FAE) for more information on package
thermal performance.
ESD CAUTION
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