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參數(shù)資料
| 型號： | ADV3203ASWZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 17/20頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC CROSSPOINT SWIT 32X16 176LQFP |
| 標準包裝： | 1 |
| 功能： | 交叉點開關 |
| 電路： | 1 x 32:16 |
| 電壓電源： | 單/雙電源 |
| 電壓 - 電源，單路/雙路(±)： | 5V，±2.5V，±3.3V |
| 電流 - 電源： | 200mA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 176-LQFP |
| 供應商設備封裝： | 176-LQFP-EP（24x24） |
| 包裝： | 托盤 |
ADV3202/ADV3203
Rev. 0 | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
POWER DISSIPATION
Table 5.
Parameter
Rating
Analog Supply Voltage (VPOS VNEG)
7.5 V
Digital Supply Voltage
(DVCC DGND)
6 V
Ground Potential Difference
(VNEG DGND)
+0.5 V to –4 V
Maximum Potential Difference
DVCC VNEG
9.4 V
Disabled Outputs
ADV3202 (|VOSD VOUT|)
<3 V
ADV3203 (|VOSD (VOUT+VREF)/2|)
<3 V
|VCLAMP VINxx|
6 V
VREF Input Voltage
ADV3202
VPOS – 3.5 V to VNEG + 3.5 V
ADV3203
VPOS – 4 V to VNEG + 4 V
Analog Input Voltage
VNEG to VPOS
Digital Input Voltage
DVCC
Output Voltage
(Disabled Analog Output)
(VPOS 1 V) to (VNEG + 1 V)
Output Short-Circuit Duration
Momentary
Output Short-Circuit Current
45 mA
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature
(Soldering, 10 sec)
300°C
Junction Temperature
150°C
The ADV3202/ADV3203 are operated with ±2.5 V, +5 V, or
±3.3 V supplies and can drive loads down to 150 Ω, resulting in
a large range of possible power dissipations. For this reason,
extra care must be taken while derating the operating conditions
based on ambient temperature.
Packaged in a 176-lead exposed-pad LQFP, the ADV3202/
ADV3203 junction-to-ambient thermal impedance (θJA) is
16°C/W. For long-term reliability, the maximum allowed
junction temperature of the die should not exceed 150°C.
Temporarily exceeding this limit may cause a shift in parametric
performance due to a change in stresses exerted on the die by
the package. Exceeding a junction temperature of 175°C for an
extended period can result in device failure. Figure 3 shows the
range of allowed internal die power dissipations that meet these
conditions over the 40°C to +85°C ambient temperature range.
When using Figure 3, do not include external load power in the
maximum power calculation, but do include load current
dropped on the die output transistors.
9
8
7
6
5
4
3
15
25
35
45
55
65
75
85
AMBIENT TEMPERATURE (°C)
MA
XI
M
U
M
P
O
W
E
R
(W
)
075
26
-00
3
TJ = 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 3. Maximum Die Power Dissipation vs. Ambient Temperature
THERMAL RESISTANCE
ESD CAUTION
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
θJA
Unit
176-Lead LQFP_EP
16
°C/W
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