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| 型號： | ADUC812BSZ-REEL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 45/57頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MCU FLASH 12BIT ADC 52MQFP |
| 標準包裝： | 800 |
| 系列： | MicroConverter® ADuC8xx |
| 核心處理器： | 8052 |
| 芯體尺寸： | 8-位 |
| 速度： | 16MHz |
| 連通性： | I²C，SPI，UART/USART |
| 外圍設(shè)備： | PSM，溫度傳感器，WDT |
| 輸入/輸出數(shù)： | 34 |
| 程序存儲器容量： | 8KB（8K x 8） |
| 程序存儲器類型： | 閃存 |
| EEPROM 大小： | 640 x 8 |
| RAM 容量： | 256 x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 2.7 V ~ 5.5 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 8x12b，D/A 2x12b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 52-QFP |
| 包裝： | 帶卷 (TR) |
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REV.
–5–
ADuC812
ADuC812BS
Parameter
VDD = 5 V
VDD = 3 V
Unit
Test Conditions/Comments
DIGITAL OUTPUTS
Output High Voltage (VOH)
2.4
V min
VDD = 4.5 V to 5.5 V
ISOURCE = 80 μA
4.0
2.6
V typ
VDD = 2.7 V to 3.3 V
ISOURCE = 20 μA
Output Low Voltage (VOL)
ALE,
PSEN, Ports 0 and 2
0.4
V max
ISINK = 1.6 mA
0.2
V typ
ISINK = 1.6 mA
Port 3
0.4
V max
ISINK = 8 mA
0.2
V typ
ISINK = 8 mA
Floating State Leakage Current
±10
μA max
±1
μA typ
Floating State Output Capacitance
10
pF typ
POWER REQUIREMENTS
14, 15, 16
IDD Normal Mode
17
43
25
mA max
MCLKIN = 16 MHz
32
16
mA typ
MCLKIN = 16 MHz
26
12
mA typ
MCLKIN = 12 MHz
8
3
mA typ
MCLKIN = 1 MHz
IDD Idle Mode
25
10
mA max
MCLKIN = 16 MHz
18
6
mA typ
MCLKIN = 16 MHz
15
6
mA typ
MCLKIN = 12 MHz
7
2
mA typ
MCLKIN = 1 MHz
IDD Power-Down Mode
18
30
15
μA max
5
μA typ
NOTES
1Specifications apply after calibration.
2Temperature range –40°C to +85°C.
3Linearity is guaranteed during normal MicroConverter core operation.
4Linearity may degrade when programming or erasing the 640 byte Flash/EE space during ADC conversion times due to on-chip charge pump activity.
5Measured in production at V
DD = 5 V after Software Calibration Routine at 25°C only.
6User may need to execute Software Calibration Routine to achieve these specifications, which are configuration dependent.
7The offset and gain calibration spans are defined as the voltage range of user system offset and gain errors that the ADuC812 can compensate.
8SNR calculation includes distortion and noise components.
9Specification is not production tested, but is supported by characterization data at initial product release.
10The temperature sensor will give a measure of the die temperature directly; air temperature can be inferred from this result.
11DAC linearity is calculated using:
Reduced code range of 48 to 4095, 0 to VREF range
Reduced code range of 48 to 3995, 0 to VDD range
DAC output load = 10 k
Ω and 50 pF.
12Flash/EE Memory Performance Specifications are qualified as per JEDEC Specification (Data Retention) and JEDEC Draft Specification A117 (Endurance).
13Endurance Cycling is evaluated under the following conditions:
Mode
= Byte Programming, Page Erase Cycling
Cycle Pattern
= 00H to FFH
Erase Time
= 20 ms
Program Time
= 100 μs
14I
DD at other MCLKIN frequencies is typically given by:
Normal Mode (VDD = 5 V):
IDD = (1.6 nAs
× MCLKIN) + 6 mA
Normal Mode (VDD = 3 V):
IDD = (0.8 nAs
× MCLKIN) + 3 mA
Idle Mode (VDD = 5 V):
IDD = (0.75 nAs
× MCLKIN) + 6 mA
Idle Mode (VDD = 3 V):
IDD = (0.25 nAs
× MCLKIN) + 3 mA
where MCLKIN is the oscillator frequency in MHz and resultant I DD values are in mA.
15I
DD currents are expressed as a summation of analog and digital power supply currents during normal MicroConverter operation.
16I
DD is not measured during Flash/EE program or erase cycles; I DD will typically increase by 10 mA during these cycles.
17Analog I
DD = 2 mA (typ) in normal operation (internal V REF, ADC, and DAC peripherals powered on).
18EA = Port0 = DV
DD, XTAL1 (Input) tied to DVDD, during this measurement.
Typical specifications are not production tested, but are supported by characterization data at initial product release.
Timing Specifications—See Pages 46–55.
Specifications subject to change without notice.
Please refer to User Guide, Quick Reference Guide, Application Notes, and Silicon Errata Sheet at www.analog.com/microconverter for additional information.
F
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