參數(shù)資料
型號: ADSP-21363SBBC-ENG
廠商: ANALOG DEVICES INC
元件分類: 數(shù)字信號處理
英文描述: SHARC Processor
中文描述: 16-BIT, 55.55 MHz, OTHER DSP, PBGA136
封裝: MO-205AE, MBGA-136
文件頁數(shù): 44/44頁
文件大小: 396K
代理商: ADSP-21363SBBC-ENG
Rev. PrA
|
Page 44 of 44
|
September 2004
ADSP-21363
Preliminary Technical Data
2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
ORDERING GUIDE
Figure 36. 136-Ball Mini-BGA (BC-136-2)
Part Number
1,
2,
3
1
Z indicates Lead Free package. For more information about lead free package offerings, please visit www.analog.com.
2
See
Thermal Characteristics on Page 37
for information on package thermal specifications.
3
See Engineer–to–Engineer Note TBD for further information.
4
PCB must have thermal vias. See
Thermal Characteristics on Page 37
. For more information see JEDEC Standard JESD51-9.
5
Heat slug must be soldered to the PCB. See
Thermal Characteristics on Page 37
. For more information see JEDEC Standard JESD51-5.
Ambient
Temperature
Range
°
C
0 to 70
0 to 70
0 to 70
0 to 70
–40 to 85
–40 to 85
–40 to 85
–40 to 85
–40 to 105
–40 to 105
Instruction
Rate
On-Chip
SRAM
ROM
Operating Voltage
Internal/External
Volts
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.2/3.3
1.0/3.3
1.0/3.3
Package
ADSP-21363SKBCZENG
ADSP-21363SKBC-ENG
ADSP-21363SKSQZENG
ADSP-21363SKSQ-ENG
ADSP-21363SBBCZENG
4
ADSP-21363SBBC-ENG
4
ADSP-21363SBSQZENG
5
ADSP-21363SBSQ-ENG
5
ADSP-21363SCSQZENG
5
ADSP-21363SCSQ-ENG
5
333MHz
333MHz
333MHz
333MHz
333MHz
333MHz
333MHz
333MHz
200MHz
200MHz
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
3M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
136 Mini-BGA Pb-free
136 Mini-BGA
144 INT–HS LQFP Pb-free
144 INT–HS LQFP
136 Mini-BGA Pb-free
136 Mini-BGA
144 INT–HS LQFP Pb-free
144 INT–HS LQFP
144 INT–HS LQFP Pb-free
144 INT–HS LQFP
SEATING
PLANE
0.25
MIN
DETAIL A
0.50
0.45
0.40
(BALL
DIAMETER)
DETAIL A
1.70
MAX
1. DIMENSIONS ARE IN MILIMETERS (MM).
2. THE ACTUAL POSITION OF THE BALL GRID IS
WITHIN 0.15 MM OF ITSIDEAL POSITION RELATIVE
TOTHEPACKAGEEDGES.
3. THE ACTUAL POSITION OF EACH BALL IS WITHIN 0.08 MM
OF ITSIDEAL POSITION RELATIVETOTHE BALL GRID.
4. COMPLIANT TOJEDEC STANDARD MO-205-AE, EXCEPT FOR
THE BALL DIAMETER.
5. CENTER DIMENSIONS ARE NOMINAL.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
10 9 8 7 6 5 4 3 2 1
13
14
11
12
TYP
10.40 BSC SQ
PIN A1 INDICATOR
BOTTOM VIEW
TOP VIEW
12.00 BSC SQ
0.12MAX (BALL
COPLANARITY)
0.80
BSC
0.80
BSC
TYP
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ADSP-21363SBBCZENG 制造商:AD 制造商全稱:Analog Devices 功能描述:SHARC Processor
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