參數(shù)資料
型號(hào)： ADS8517IDW
廠商： TEXAS INSTRUMENTS INC
元件分類： ADC
英文描述： 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL/PARALLEL ACCESS, PDSO28
封裝： GREEN, PLASTIC, SOIC-28
文件頁(yè)數(shù)： 26/38頁(yè)
文件大小： 948K
代理商： ADS8517IDW
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
ADS8517IBDW
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8517IBDWG4
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8517IBDWR
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8517IBDWRG4
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8517IBPW
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ADS8517IBPWR
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ADS8517IDW
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8517IDWG4
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8517IDWR
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8517IDWRG4
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ADS8517IPW
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ADS8517IPWR
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jun-2009
Addendum-Page 1
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADS8517IDWG4 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 16B,5V,125KSPS,ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
ADS8517IDWR 功能描述:模數(shù)轉(zhuǎn)換器 - ADC Low Power 16-Bit 200 kSPS ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
ADS8517IDWRG4 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 16B,5V,125KSPS,ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
ADS8517IPW 功能描述:模數(shù)轉(zhuǎn)換器 - ADC Lo Pwr 16B 200kSPS +/-10V Bip InSAR ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
ADS8517IPWR 功能描述:模數(shù)轉(zhuǎn)換器 - ADC Lo Pwr 16B 200kSPS +/-10V Bip InSAR ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
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