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參數(shù)資料
| 型號： | ADS7815UG4 |
| 廠商： | Texas Instruments |
| 文件頁數(shù)： | 2/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC 16BIT 250KHZ ADC CONV 28-SOIC |
| 產品培訓模塊： | Data Converter Basics |
| 標準包裝： | 20 |
| 位數(shù)： | 16 |
| 采樣率（每秒）： | 250k |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉換器數(shù)目： | 1 |
| 功率耗散（最大）： | 250mW |
| 電壓電源： | 雙 ± |
| 工作溫度： | -25°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 28-SOIC（0.295"，7.50mm 寬） |
| 供應商設備封裝： | 28-SOIC |
| 包裝： | 管件 |
| 輸入數(shù)目和類型： | 1 個單端，雙極 |
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2010
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
ADS7815U
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
ADS7815U/1K
ACTIVE
SOIC
DW
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
ADS7815U/1KE4
ACTIVE
SOIC
DW
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
ADS7815UE4
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
ADS7815UG4
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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