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參數(shù)資料
型號： ADS62C17IRGC25
廠商： Texas Instruments
文件頁數(shù)： 68/68頁
文件大小： 0K
描述： IC ADC 11BIT 200MSPS DUAL 64VQFN
標(biāo)準(zhǔn)包裝： 25
位數(shù)： 11
采樣率（每秒）： 200M
數(shù)據(jù)接口： 串行，并聯(lián)
轉(zhuǎn)換器數(shù)目： 2
功率耗散（最大）： 1.1W
電壓電源： 模擬和數(shù)字
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 64-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 64-VQFN 裸露焊盤（9x9）
包裝： 帶卷 (TR)
輸入數(shù)目和類型： 2 個差分，單極
TIMING CHARACTERISTICS — LVDS AND CMOS MODES
(1)
www.ti.com ............................................................................................................................................................. SLAS631A – APRIL 2009 – REVISED JULY 2009
Typical values are at 25°C, AVDD = 3.3V, DRVDD = 1.8V, sampling frequency = 200 MSPS, sine wave input clock, CLOAD =
5pF
(2), R
LOAD = 100
(3), no internal termination, LOW SPEED mode disabled, unless otherwise noted.
Min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = 3.3V, DRVDD = 1.7V to
1.9V.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ta
Aperture delay
0.7
1.2
1.7
ns
Aperture delay matching
between two channels of the same device
±50
ps
tj
Aperture jitter
145
fs rms
Time to valid data after coming out of STANDBY mode
1
3
s
Wake-up time
Time to valid data after coming out of global powerdown
20
50
Time to valid data after stopping and restarting the input clock
10
Clock
cycles
ADC Latency(4)
Default, after reset
22
DDR LVDS MODE(5)
tsu
Data setup time(6)
Data valid(7) to zero-crossing of CLKOUTP
0.8
1.15
ns
th
Data hold time(7)
Zero-crossing of CLKOUTP to data becoming invalid(7)
0.8
1.15
ns
tPDI
Clock propagation delay
Input clock falling edge cross-over to output clock rising edge
tPDI = 0.69×Ts + tdelay
cross-over
100 MSPS
≤ Sampling frequency ≤ 200 MSPS
tdelay
4.2
5.7
7.2
ns
Ts = 1/Sampling frequency
Difference in tdelay between two devices operating at same
tdelay skew
±500
ps
temperature & SVDD supply voltage.
Duty cycle of differential clock, (CLKOUTP-CLKOUTM)
LVDS bit clock duty cycle
52%
100 MSPS
≤ Sampling frequency ≤ 200 MSPS
Rise time measured from –100 mV to +100 mV
tRISE, tFALL
Data rise time, Data fall time
Fall time measured from +100 mV to –100 mV
0.14
ns
1MSPS
≤ Sampling frequency ≤ 200 MSPS
Rise time measured from –100 mV to +100 mV
Output clock rise time,
tCLKRISE,
Fall time measured from +100 mV to –100 mV
0.14
ns
tCLKFALL
Output clock fall time
1 MSPS
≤ Sampling frequency ≤ 200 MSPS
tOE
Output buffer enable to data delay
Time to valid data after output buffer becomes active
100
ns
PARALLEL CMOS MODE at Fs=200 MSPS(8)
tSTART
Input clock to data delay
Input clock falling edge cross-over to start of data valid(7)
2.5
ns
tDV
Data valid time
Time interval of valid data(7)
1.7
2.7
ns
tPDI
Clock propagation delay
Input clock falling edge cross-over to output clock rising edge
tPDI = 0.28×Ts + tdelay
cross-over
100 MSPS
≤ Sampling frequency ≤ 150 MSPS
tdelay
5.5
7.5
8.5
ns
Ts = 1/Sampling frequency
Duty cycle of output clock, CLKOUT
Output clock duty cycle
43
100 MSPS
≤ Sampling frequency ≤ 150 MSPS
Rise time measured from 20% to 80% of DRVDD
tRISE, tFALL
Data rise time, Data fall time
Fall time measured from 80% to 20% of DRVDD
1.2
ns
1
≤ Sampling frequency ≤ 200 MSPS
Rise time measured from 20% to 80% of DRVDD
Output clock rise time,
tCLKRISE,
Fall time measured from 80% to 20% of DRVDD
0.8
ns
tCLKFALL
Output clock fall time
1
≤ Sampling frequency ≤ 150 MSPS
Output buffer enable (OE) to data
tOE
Time to valid data after output buffer becomes active
100
ns
delay
(1)
Timing parameters are ensured by design and characterization and not tested in production.
(2)
CLOAD is the effective external single-ended load capacitance between each output pin and ground
(3)
RLOAD is the differential load resistance between the LVDS output pair.
(4)
At higher frequencies, tPDI is greater than one clock period and overall latency = ADC latency + 1.
(5)
Measurements are done with a transmission line of 100
characteristic impedance between the device and the load.
Setup and hold time specifications take into account the effect of jitter on the output data and clock.
(6)
Data valid refers to LOGIC HIGH of +100.0mV and LOGIC LOW of -100.0mV.
(7)
Data valid refers to LOGIC HIGH of 1.26V and LOGIC LOW of 0.54V.
(8)
For Fs> 150 MSPS, it is recommended to use external clock for data capture and NOT the device output clock signal (CLKOUT).
Copyright 2009, Texas Instruments Incorporated
9
Product Folder Link(s): ADS62C17
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