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參數(shù)資料
| 型號： | ADS-EVAL3 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 元件分類： | 串行ADC |
| 英文描述： | 16-Bit, 500kHz Sampling A/D Converters |
| 中文描述： | 16位，500kHz的采樣A / D轉換器 |
| 文件頁數(shù)： | 6/8頁 |
| 文件大小： | 603K |
| 代理商： | ADS-EVAL3 |
ADS -930
6
Gain Adjust Procedure
1. Apply +4.999771V to the ANALOG INPUT (pin 3) for bipolar
gain adjust or apply –9.999771V to pin 3 for unipolar gain
adjust.
2. For a unipolar input - adjust the gain potentiometer until all
output bits are 1's and the LSB flickers between a 1 and 0
with pin 8 tied high (straight binary) or until all output bits
are 0's and the LSB flickers between a 1 and 0 with pin 8
tied low (complementary binary).
For a bipolar input - adjust the gain potentiometer until all
output bits are 1's and the LSB flickers between a 1 and 0
with pin 8 tied low (complementary offset binary) or until all
output bits are 0's and the LSB flickers between a 1 and 0
with pin 8 tied high (offset binary).
3. Two's complement coding requires using pin 40. With pin 8
tied high, adjust the gain trimpot until the output code
flickers equally between 1000 0000 0000 0000 and 1000
0000 0000 0001.
THERMAL REQUIREMENTS
All DATEL sampling A/D converters are fully characterized and
specified over operating temperature (case) ranges of
0 to +70°C and –55 to +125°C. All room-temperature
(T
A
= +25°C) production testing is performed without the use of
heat sinks or forced-air cooling. Thermal impedance figures
for each device are listed in their respective specification
tables.
These devices do not normally require heat sinks, however,
standard precautionary design and layout procedures should
be used to ensure devices do not overheat. The ground and
power planes beneath the package, as well as all pcb signal
runs to and from the device, should be as heavy as possible to
help conduct heat away from the package. Electrically-
insulating, thermally-conductive "pads" may be installed
underneath the package. Devices should be soldered to
boards rather than "socketed", and of course, minimal air flow
over the surface can greatly help reduce the package
temperature.
In more severe ambient conditions, the package/junction
temperature of a given device can be reduced dramatically
(typically 35%) by using one of DATEL's HS Series heat sinks.
See Ordering Information for the assigned part number. See
page 1-183 of the DATEL Data Acquisition Components
Catalog for more information on the HS Series. Request
DATEL Application Note AN-8, "Heat Sinks for DIP Data
Converters," or contact DATEL directly, for additional data.
Figure 4. FFT Analysis of ADS-930
Figure 3. ADS-930 Timing Diagram
Note: Scale is approximately 50ns per division.
START
CONVERT
INTERNAL S/H
N
10ns min., 25ns max.
EOC
OUTPUT
DATA
Data N-1 Valid
Hold 1.54μs typ.
140ns max.
Data N Valid
1.39μs min.
Invalid
Data
460ns typ. 545ns max.
Acquisition Time
10ns min.
25ns max.
Conversion Time
700ns ±30ns
175ns min., 200ns typ., 215ns max .
N+1
780ns ±30ns
30ns min .
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