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| 型號： | ADG3247BCP |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 通用總線功能 |
| 英文描述： | 2.5 V/3.3 V, 16-Bit, 2-Port Level Translating, Bus Switch |
| 中文描述： | DUAL 8-BIT DRIVER, TRUE OUTPUT, QCC40 |
| 封裝： | 6 X 6 MM, MO-220-VJJD-2, CSP-40 |
| 文件頁數(shù)： | 3/12頁 |
| 文件大小： | 204K |
| 代理商： | ADG3247BCP |
PRELIMINARY TECHNICAL DATA
REV. PrD
ADG3247
–3–
ABSOLUTE MAXIMUM RATINGS
*
(T
A
= 25
°
C, unless otherwise noted.)
V
CC
to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°
C
LFCSP Package
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 32
°
C/W
TSSOP Package
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 98
°
C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300
°
C
IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235
°
C
*
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG3247 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
Table I. Pin Description
Mnemonic
Description
BEx
SEL
Ax
Bx
Bus Enable (Active Low)
Level Translation Select
Port A, Inputs or Outputs
Port B, Inputs or Outputs
Table II. Truth Table
BEx
SEL
*
Function
L
L
H
L
H
X
A = B, 3.3 V to 1.8 V Level Shifting
A = B, 3.3 V to 2.5 V/2.5V to 1.8 V Level Shifting
Disconnect
*
SEL
= 0 only when V
DD
= 3.3 V
±
10%
PIN CONFIGURATION
40-Lead LFCSP and 38-Lead TSSOP
PIN 1
TOP VIEW
ADG3247
1
2
3
4
5
6
7
8
9
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
10
NC = NO CONNECT
G
N
N
N
B
B
B
B
B
B
30 B0
29 B1
28 B2
27 B3
26 B4
25 B5
24 B6
23 B7
22 B8
21 B9
4
3
3
3
3
3
3
S
3
3
B
3
B
TOP VIEW
(Not to Scale)
38
37
36
35
34
33
32
1
2
3
4
5
6
7
SEL
A0
A1
A2
A3
A4
A5
V
CC
BE2
BE1
B0
B1
B2
B3
ADG3247
31
30
29
8
9
10
A6
A7
A8
B4
B5
B6
28
27
11
12
A9
A10
B7
B8
26
25
A11
A12
B9
B10
24
23
22
17
A13
A14
A15
B11
B12
B13
21
20
18
19
GND
NC
B14
B15
13
14
15
16
ORDERING GUIDE
Model
Temperature Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Package Description
Package Option
ADG3247BCP
ADG3247BRU
Leaded Chip Scale Package (LFCSP)
Thin Shrink Small Outline Package (TSSOP)
CP-40
RU-38
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