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參數(shù)資料
| 型號(hào)： | ADG3247BCP |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 通用總線功能 |
| 英文描述： | 2.5 V/3.3 V, 16-Bit, 2-Port Level Translating, Bus Switch |
| 中文描述： | DUAL 8-BIT DRIVER, TRUE OUTPUT, QCC40 |
| 封裝： | 6 X 6 MM, MO-220-VJJD-2, CSP-40 |
| 文件頁數(shù)： | 10/12頁 |
| 文件大?。?/td> | 204K |
| 代理商： | ADG3247BCP |
PRELIMINARY TECHNICAL DATA
REV. PrD
ADG3247
–10–
V
IN
1.8V
V
OUT
0V
3.3V
SWITCH
INPUT
S
O
3.3V SUPPLY
SEL
= 0V
Figure 10. 3.3 V to 1.8 V Voltage Translation,
SEL
= 0 V
Bus Isolation
A common requirement of bus architectures is low capacitance
loading of the bus. Such systems require bus bridge devices that
extend the number of loads on the bus without exceeding the
specifications. Because the ADG3247 is designed specifically for
applications that do not need drive yet require simple logic func-
tions, it solves this requirement. The device isolates access to the
bus, thus minimizing capacitance loading.
Bus/
Backplane
Load A
Load C
Load B
Load D
Bus Switch
Location
Figure 11. Location of Bus Switched in a Bus
Isolation Application
Hot Plug and Hot Swap Isolation
The ADG3247 is suitable for hot swap and hot plug applications.
The output signal of the ADG3247 is limited to a voltage that is
below the V
CC
supply, as shown in Figures 6, 8, and 10. There-
fore the switch acts like a buffer to take the impact from hot
insertion, protecting vital and expensive chipsets from damage.
In hot-plug applications, the system cannot be shutdown when
new hardware is being added. To overcome this, a bus switch can
be positioned on the backplane between the bus devices and the
hot plug connectors. The bus switch is turned off during hot plug.
Figure 12 shows a typical example of this type of application.
PLUG-IN
CARD (1)
CARD I/O
CARD I/O
RAM
CPU
PLUG-IN
CARD (2)
A
A
Figure 12. ADG3247 in a Hot Plug Application
There are many systems that require the ability to handle hot
swapping, such as docking stations, PCI boards for servers, and
line cards for telecommunications switches. If the bus can be
isolated prior to insertion or removal, then there is more control
over the hot swap event. This isolation can be achieved using a
bus switch. The bus switches are positioned on the hot swap card
between the connector and the devices. During hot swap, the
ground pin of the hot swap card must connect to the ground pin
of the back plane before any other signal or power pins.
Analog Switching
Bus switches can be used in many analog switching applications;
for example, video graphics. Bus switches can have lower on
resistance, smaller ON and OFF channel capacitance and thus
improved frequency performance than their analog counterparts.
The bus switch channel itself consisting solely of an NMOS
switch limits the operating voltage (see TPC 1 for a typical plot),
but in many cases this does not present an issue.
High Impedance during Power-Up/Power-Down
To ensure the high impedance state during power-up or power-
down, BEx should be tied to V
CC
through a pull-up resistor; the
minimum value of the resistor is determined by the current-
sinking capability of the driver.
PACKAGE AND PINOUT
The ADG3247 is packaged in both a small 38-lead TSSOP or a
tiny 40-lead LFCSP package. The area of the TSSOP option is
62.7 mm
2
, while the area of the LFCSP option is 36 mm
2
. This
leads to a 43% savings in board space when using the LFCSP
package compared with the TSSOP package. This makes the LFCSP
option an excellent choice for space-constrained applications.
The ADG3247 in the TSSOP package offers a flowthrough
pinout. The term flowthrough signifies that all the inputs are on
opposite sides from the outputs. A flowthrough pinout simplifies
the PCB layout.
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| ADG3247BRU | 2.5 V/3.3 V, 16-Bit, 2-Port Level Translating, Bus Switch |
| ADG3247 | 2.5 V/3.3 V, 16-Bit, 2-Port Level Translating, Bus Switch |
| ADG3248 | 2.5 V/ 3.3 V, 2 :1 Multiplexer/ Demultiplexer Bus Switch |
| ADG3248BKS-R2 | 2.5 V/ 3.3 V, 2 :1 Multiplexer/ Demultiplexer Bus Switch |
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相關(guān)代理商/技術(shù)參數(shù) |
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| ADG3247BCP-REEL | 制造商:Analog Devices 功能描述:Bus Switch 2-Element CMOS 16-IN 40-Pin LFCSP EP T/R |
| ADG3247BCP-REEL7 | 制造商:Analog Devices 功能描述:Bus Switch 2-Element CMOS 16-IN 40-Pin LFCSP EP T/R 制造商:Analog Devices 功能描述:BUS SWIT 2-ELEM 8-IN 40LFCSP EP - Tape and Reel |
| ADG3247BCPZ | 功能描述:IC SW BUS 2.5-3.3V 16BIT 40LFCSP RoHS:是 類別:集成電路 (IC) >> 邏輯 - 信號(hào)開關(guān)，多路復(fù)用器，解碼器 系列:- 標(biāo)準(zhǔn)包裝:48 系列:74VHC 類型:多路復(fù)用器 電路:4 x 2:1 獨(dú)立電路:1 輸出電流高，低:8mA，8mA 電壓電源:單電源 電源電壓:2 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:管件 |
| ADG3247BCPZ-REEL | 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述: |
| ADG3247BRU | 功能描述:IC SW BUS 2.5/3.3V 16BIT 38TSSOP RoHS:否 類別:集成電路 (IC) >> 邏輯 - 信號(hào)開關(guān)，多路復(fù)用器，解碼器 系列:- 標(biāo)準(zhǔn)包裝:48 系列:74VHC 類型:多路復(fù)用器 電路:4 x 2:1 獨(dú)立電路:1 輸出電流高，低:8mA，8mA 電壓電源:單電源 電源電壓:2 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:管件 |
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