
ADG3242
Rev. A | Page 5 of 16
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
BE 1
A0 2
A1 3
GND 4
VCC
8
SEL
7
B0
6
B1
5
ADG3242
TOP VIEW
(Not to Scale)
043
09
-00
2
04
30
9-
10
0
ADI DIE MARK
A0
A1
B0
B1
GND
SEL VCC BE
ADG3242
TOP VIEW
(Not to Scale)
Figure 2. Pin Configuration
Figure 3. Die Pad Configuration (Die size: 550 μm × 820 μm)
Table 3. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
BE
Bus Enable (Active Low).
2
A0
Port A0, Input or Output.
3
A1
Port A1, Input or Output.
4
GND
Ground (0 V) Reference.
5
B1
Port B1, Input or Output.
6
B0
Port B0, Input or Output.
7
SEL
Level Translation Select.
8
VCC
Positive Power Supply Voltage.
Table 4. Die Pad Coordinates (Measured from the Center of the Die)
Mnemonic
X(μm)
Y(μm)
BE
+93
+303
A0
+102
+150
A1
+168
139
GND
+126
266
B1
88
247
B0
168
+121
SEL
111
+279
VCC
7
+303
Table 5. Truth Table
BE
Function
L
A0 = B0, A1 = B1, 3.3 V to 1.8 V Level Shifting.
L
H
A0 = B0, A1 = B1, 3.3 V to 2.5 V/2.5 V to 1.8 V Level Shifting.
H
X
Disconnect.
1
SEL = 0 V only when VDD = 3.3 V ± 10%.