參數資料
型號: ADF4106SCPZ-EP
廠商: Analog Devices Inc
文件頁數: 12/12頁
文件大?。?/td> 0K
描述: IC PLL FREQ SYNTHESIZER 20LFCSP
標準包裝: 1
類型: 頻率合成器
PLL:
輸入: CMOS,TTL
輸出: 時鐘
電路數: 1
比率 - 輸入:輸出: 2:1
差分 - 輸入:輸出: 是/無
頻率 - 最大: 6GHz
除法器/乘法器: 無/無
電源電壓: 2.7 V ~ 3.3 V
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 20-VFQFN 裸露焊盤,CSP
供應商設備封裝: 20-LFCSP-VQ
包裝: 托盤
Data Sheet
ADF4106-EP
Rev. B | Page 9 of 12
PCB DESIGN GUIDELINES FOR CHIP SCALE PACKAGE
The lands on the 20-lead LFCSP (CP-20) are rectangular. The
printed circuit board (PCB) pad for these should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. The land should be centered on the
pad. This ensures that the solder joint size is maximized. The
bottom of the LFCSP has a central thermal pad.
The thermal pad on the PCB should be at least as large as this
exposed pad. On the PCB, there should be a clearance of at least
0.25 mm between the thermal pad and the inner edges of the
pad pattern. This ensures that shorting is avoided.
Thermal vias may be used on the PCB thermal pad to improve
thermal performance of the package. If vias are used, they should
be incorporated in the thermal pad at 1.2 mm pitch grid. The
via diameter should be between 0.3 mm and 0.33 mm, and the
via barrel should be plated with 1 oz. copper to plug the via.
The user should connect the PCB thermal pad to AGND.
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相關代理商/技術參數
參數描述
ADF4106SCPZ-EP-R7 功能描述:IC PLL FREQ SYNTHESIZER 20LFCSP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘發(fā)生器,PLL,頻率合成器 系列:- 標準包裝:1,000 系列:Precision Edge® 類型:時鐘/頻率合成器 PLL:無 輸入:CML,PECL 輸出:CML 電路數:1 比率 - 輸入:輸出:2:1 差分 - 輸入:輸出:是/是 頻率 - 最大:10.7GHz 除法器/乘法器:無/無 電源電壓:2.375 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VFQFN 裸露焊盤,16-MLF? 供應商設備封裝:16-MLF?(3x3) 包裝:帶卷 (TR) 其它名稱:SY58052UMGTRSY58052UMGTR-ND
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