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參數(shù)資料
| 型號： | ADCLK954/PCBZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 8/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | KIT EVAL CLK BUFF ADCLK954 |
| 設(shè)計資源： | ADCLK954/950 Brd Schematic ADCLK954 BOM ADCLK954 Gerber Files |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | SIGe |
| 主要目的： | 計時，時鐘緩沖器 / 驅(qū)動器 / 接收器 / 變換器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADCLK954 |
| 主要屬性： | 2 輸入，12 輸出 |
| 次要屬性： | LVPECL 輸出邏輯 |
| 已供物品： | 板 |
ADCLK954
Rev. B | Page 5 of 12
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Supply Voltage
VCC VEE
6.0 V
Input Voltage
CLK0, CLK1, CLK0, CLK1, IN_SEL
VEE 0.5 V to
VCC + 0.5 V
CLK0, CLK1, CLK0, CLK1 to VTx Pin (CML,
LVPECL Termination)
±40 mA
CLK0, CLK1 to CLK0, CLK1
±1.8 V
Input Termination, VTx to CLK0, CLK1, CLK0,
and CLK1
±2 V
Maximum Voltage on Output Pins
VCC + 0.5 V
Maximum Output Current
35 mA
Voltage Reference (VREFx)
VCC to VEE
Operating Temperature Range
Ambient
40°C to +85°C
Junction
150°C
Storage Temperature Range
65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
DETERMINING JUNCTION TEMPERATURE
To determine the junction temperature on the application
printed circuit board (PCB), use the following equation:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the customer at
the top center of the package.
PD is the power dissipation.
Values of
θJA are provided for package comparison and PCB
design considerations.
θJA can be used for a first-order approxi-
mation of TJ by the equation
TJ = TA + (
θJA × PD)
where
TA is the ambient temperature (°C).
Values of
and PCB design considerations.
ESD CAUTION
THERMAL PERFORMANCE
Table 6.
Parameter
Symbol
Description
Value1
Unit
Junction-to-Ambient Thermal Resistance
θJA
Still Air
Per JEDEC JESD51-2
0.0 m/sec Air Flow
46.1
°C/W
Moving Air
θJMA
Per JEDEC JESD51-6
1.0 m/sec Air Flow
40.3
°C/W
2.5 m/sec Air Flow
36.2
°C/W
Junction-to-Board Thermal Resistance
θJB
Moving Air
Per JEDEC JESD51-8
1.0 m/sec Air Flow
28.7
°C/W
Junction-to-Case Thermal Resistance
θJC
Moving Air
Per MIL-STD 883, Method 1012.1
Die-to-Heat Sink
8.3
°C/W
Junction-to-Top-of-Package Characterization Parameter
ΨJT
Still Air
Per JEDEC JESD51-2
0 m/sec Air Flow
0.6
°C/W
1 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these calculations.
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