參數(shù)資料
型號(hào)： ADA4960-1ACPZ-R2
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 10/20頁(yè)
文件大?。?/td> 0K
描述： IC ADC DRIVER DIFF 16LFCSP
標(biāo)準(zhǔn)包裝： 1
類型： ADC 驅(qū)動(dòng)器
應(yīng)用： 數(shù)據(jù)采集
安裝類型： 表面貼裝
封裝/外殼： 16-WFQFN 裸露焊盤，CSP
供應(yīng)商設(shè)備封裝： 16-LFCSP-WQ（3x3）
包裝： 標(biāo)準(zhǔn)包裝
其它名稱： ADA4960-1ACPZ-R2DKR
ADA4960-1
Rev. 0 | Page 18 of 20
LAYOUT, GROUNDING, AND BYPASSING
The ADA4960-1 is a high speed device. Realizing its superior
performance requires attention to the details of high speed
printed circuit board (PCB) design.
The first requirement is to use a multilayer PCB with solid ground
and power planes that cover as much of the board area as possible.
Bypass each power supply pin directly to a nearby ground plane, as
close to the device as possible. Use 0.1 μF high frequency ceramic
chip capacitors.
Provide low frequency bulk bypassing, using 10 μF tantalum
capacitors from each supply to ground.
Stray transmission line capacitance in combination with package
parasitics can potentially form a resonant circuit at high frequencies,
resulting in excessive gain peaking or possible oscillation.
Signal routing should be short and direct to avoid such parasitic
effects. Provide symmetrical layout for complementary signals
to maximize balanced performance.
Use radio frequency transmission lines to connect the driver
and receiver to the amplifier.
Minimize stray capacitance at the input/output pins by clearing
the underlying ground and low impedance planes near these pins.
If the driver/receiver is more than one-eighth of the wavelength
from the amplifier, the signal trace widths should be minimal.
This nontransmission line configuration requires the underlying
and adjacent ground and low impedance planes to be cleared
near the signal lines.
The exposed thermal paddle is internally connected to the ground
pin of the amplifier. Solder the paddle to the low impedance
ground plane on the PCB to ensure the specified electrical
performance and to provide thermal relief. To reduce thermal
impedance further, it is recommended that the ground planes
on all layers under the paddle be connected together with vias.
08
45
8-
03
6
0.3mm DIAMETER VIAS
1.2mm
1.5mm
1.
2m
m
1.
5m
m
Figure 44. Recommended PCB Thermal Attach Pad
TOP METAL
GROUND PLANE
POWER PLANE
BOTTOM METAL
1.5mm
1.2mm
08
45
8-
03
7
Figure 45. Cross-Section of a 4-Layer PCB Showing Thermal Via Connection to Buried Ground Plane
相關(guān)PDF資料
PDF描述
ADATE205BSVZ IC DCL DUAL 250MHZ ATE 100TQFP
ADATE206BSVZ IC DCL DUAL 500MHZ ATE 100TQFP
ADAU1401AWBSTZ-RL IC AUDIO PROC 28/56BIT 48LQFP
ADAU1401YSTZ-RL IC AUDIO PROC 28/56BIT 48LQFP
ADAU1442YSVZ-3A-RL IC SIGMADSP 28B 175MHZ 100TQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADA4960-1ACPZ-R7 功能描述:IC ADC DRIVER DIFF 16LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變?cè)鲆娣糯笃?應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP（5x5） 包裝:托盤
ADA4960-1ACPZ-RL 功能描述:IC ADC DRIVER DIFF 16LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類型:可變?cè)鲆娣糯笃?應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP（5x5） 包裝:托盤
ADA4961ACPZN-R7 功能描述:RF Amplifier IC 1.8GHz ~ 3.2GHz 24-LFCSP (4x4) 制造商:analog devices inc. 系列:- 包裝:剪切帶（CT） 零件狀態(tài):在售 頻率:1.8GHz ~ 3.2GHz P1dB:17.8dBm 增益:18dB 噪聲系數(shù):5.5dB RF 類型:- 電壓 - 電源:3.3 V ~ 5 V 電流 - 電源:15mA 測(cè)試頻率:- 封裝/外殼:24-WFQFN 裸露焊盤 供應(yīng)商器件封裝:24-LFCSP（4x4） 標(biāo)準(zhǔn)包裝:1
ADA5200IAA6CS 制造商:Advanced Micro Devices 功能描述:
ADA60 制造商:Panduit Corp 功能描述:
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*