參數(shù)資料
型號(hào)： ADA4855-3YCP-EBZ
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 16/20頁(yè)
文件大?。?/td> 0K
描述： BOARD EVAL FOR ADA4855-3YCP
標(biāo)準(zhǔn)包裝： 1
每 IC 通道數(shù)： 3 - 三
放大器類型： 電壓反饋
板類型： 裸（未填充）
已供物品： 板
已用 IC / 零件： 16-LFCSP 封裝
Data Sheet
ADA4855-3
Rev. A | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
6 V
Internal Power Dissipation1
Common-Mode Input Voltage
(VS 0.2 V) to (+VS 1 V)
Differential Input Voltage
±VS
Output Short-Circuit Duration
Observe power curves
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +105°C
Lead Temperature (Soldering, 10 sec)
300°C
1
Specification is for device in free air.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is specified
for a device soldered in a circuit board for surface-mount packages.
Table 4.
Package Type
θJA
θJC
Unit
16-Lead LFCSP
67
17.5
°C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
ADA4855-3 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for
plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately 150°C.
Temporarily exceeding this limit may cause a shift in parametric
performance due to a change in the stresses exerted on the die
by the package. Exceeding a junction temperature of 175°C for
an extended period can result in device failure.
To ensure proper operation, it is necessary to observe the
maximum power derating curves.
3.0
2.5
2.0
1.5
1.0
0.5
0
07685-
103
MA
XI
MU
M
PO
W
ER
D
ISSI
PA
T
IO
N
(W
)
AMBIENT TEMPERATURE (°C)
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
90
100
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
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