參數(shù)資料
型號(hào)： AD9707BCPZRL7
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 12/44頁(yè)
文件大?。?/td> 0K
描述： IC DAC TX 14BIT 175MSPS 32-LFCSP
產(chǎn)品培訓(xùn)模塊： Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝： 1,500
系列： TxDAC®
設(shè)置時(shí)間： 11ns
位數(shù)： 14
數(shù)據(jù)接口： 串行
轉(zhuǎn)換器數(shù)目： 1
電壓電源： 模擬和數(shù)字
功率耗散（最大）： 50mW
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 32-VFQFN 裸露焊盤，CSP
供應(yīng)商設(shè)備封裝： 32-LFCSP-VQ（5x5）
包裝： 帶卷 (TR)
輸出數(shù)目和類型： 2 電流，單極
采樣率（每秒）： 175M
AD9704/AD9705/AD9706/AD9707
Data Sheet
Rev. B | Page 2 of 44
TABLE OF CONTENTS
REVISION HISTORY
10/11—Rev. A to Rev. B
Changes to Features Section............................................................ 1
Changes to Table 1............................................................................ 5
Changes to Table 2............................................................................ 6
Changes to Table 4............................................................................ 8
Changes to Table 5............................................................................ 9
Changes to Figure 3 and Table 9................................................... 12
Changes to Figure 4 and Table 10................................................. 13
Changes to Figure 5 and Table 11................................................. 14
Changes to Figure 6 and Table 12................................................. 15
Changes to Figure 15 and Figure 16............................................. 17
Moved Figure 41 to Figure 24 Position........................................ 18
Moved Figure 42 to Figure 25 Position and Moved Figure 43 to
Figure 26 Position........................................................................... 19
Changes to Figure 27...................................................................... 20
Changes to Figure 33 to Figure 35................................................ 21
Moved Figure 24 to Figure 41 Position........................................ 22
Moved Figure 25 to Figure 43 Position and Moved Figure 26 to
Figure 44 Position........................................................................... 23
Changes to Figure 44...................................................................... 23
Changes to Figure 57...................................................................... 26
Changes to Figure 70...................................................................... 29
Changes to Serial Peripheral Interface Section .......................... 30
Changes to Table 15 ....................................................................... 32
Deleted Table 23; Renumbered Sequentially .............................. 33
Changes to Reference Operation Section and Reference Control
Amplifier Section............................................................................ 34
Changes to Adjustable Output Common Mode Section and
DAC Timing Section...................................................................... 36
Added the Deskew Mode Section ................................................ 36
Deleted Figure 80; Renumbered Sequentially ............................ 36
Changed Sleep and Power-Down Operation (Pin Mode) Section
to Sleep Operation (Pin Mode) Section ...................................... 38
Changes to Sleep Operation (Pin Mode) Section ...................... 38
Changes to Self-Calibration Section ............................................ 39
Changes to Evaluation Board Section.......................................... 41
Added Exposed Pad Notation to Outline Dimensions ............. 42
Changes to Ordering Guide .......................................................... 42
Deleted Evaluation Board Schematics Section........................... 43
Deleted Figure 92 to Figure 102 ................................................... 43
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