參數(shù)資料
型號(hào)： AD9640ABCPZ-80
廠商： Analog Devices Inc
文件頁數(shù)： 6/52頁
文件大小： 0K
描述： IC ADC 14BIT 80MSPS 64LFCSP
設(shè)計(jì)資源： Interfacing ADL5534 to AD9640 High Speed ADC (CN0049)
標(biāo)準(zhǔn)包裝： 1
位數(shù)： 14
采樣率（每秒）： 80M
數(shù)據(jù)接口： 串行，SPI?
轉(zhuǎn)換器數(shù)目： 2
功率耗散（最大）： 492mW
電壓電源： 模擬和數(shù)字
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 64-VFQFN 裸露焊盤，CSP
供應(yīng)商設(shè)備封裝： 64-LFCSP-VQ（9x9）
包裝： 托盤
輸入數(shù)目和類型： 4 個(gè)單端，單極；2 個(gè)差分，單極
AD9640
Rev. B | Page 14 of 52
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 9.
Parameter
Rating
ELECTRICAL
AVDD, DVDD to AGND
0.3 V to +2.0 V
DRVDD to DRGND
0.3 V to +3.9 V
AGND to DRGND
0.3 V to +0.3 V
AVDD to DRVDD
3.9 V to +2.0 V
VIN+A/VIN+B, VINA/VINB to AGND
0.3 V to AVDD + 0.2 V
CLK+, CLK to AGND
0.3 V to +3.9 V
SYNC to AGND
0.3 V to +3.9 V
VREF to AGND
0.3 V to AVDD + 0.2 V
SENSE to AGND
0.3 V to AVDD + 0.2 V
CML to AGND
0.3 V to AVDD + 0.2 V
RBIAS to AGND
0.3 V to AVDD + 0.2 V
CSB to AGND
0.3 V to +3.9 V
SCLK/DFS to DRGND
0.3 V to +3.9 V
SDIO/DCS to DRGND
0.3 V to DRVDD + 0.3 V
SMI SDO/OEB
0.3 V to DRVDD + 0.3 V
0.3 V to DRVDD + 0.3 V
SMI SDFS
0.3 V to DRVDD + 0.3 V
D0A/D0B through D13A/D13B to
DRGND
0.3 V to DRVDD + 0.3 V
FD0A/FD0B through FD3A/FD3B to
DRGND
0.3 V to DRVDD + 0.3 V
DCOA/DCOB to DRGND
0.3 V to DRVDD + 0.3 V
ENVIRONMENTAL
Operating Temperature Range
(Ambient)
40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
65°C to +150°C
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the customer
board increases the reliability of the solder joints and maximizes
the thermal capability of the package.
Table 10. Thermal Resistance
Package
Type
Airflow
Velocity
(m/s)
Unit
64-lead LFCSP
9 mm × 9 mm
0
18.8
0.6
6.0
°C/W
1.0
16.5
°C/W
2.0
15.8
°C/W
1 JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown, airflow improves heat dissipation, which
reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes, reduces the θJA.
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
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