參數(shù)資料
型號(hào): AD9444BSVZ-80
廠商: ANALOG DEVICES INC
元件分類: ADC
英文描述: 14-Bit, 80 MSPS, A/D Converter
中文描述: 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP100
封裝: LEAD FREE, PLASTIC, MS-026-AED, TQFP-100
文件頁(yè)數(shù): 39/40頁(yè)
文件大?。?/td> 1291K
代理商: AD9444BSVZ-80
AD9444
OUTLINE DIMENSIONS
Rev. 0 | Page 39 of 40
COMPLIANT TO JEDEC STANDARDS MS-026AED-HD
NOTES
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
3. THE EXPOSED HEAT SINK SOLDERED TO THE GROUND PLANE IS REQUIRED FOR THE 100-LEAD TQFP/EP.
1
25
26
50
76
100
75
51
14.00 SQ
16.00 SQ
0.27
0.22
0.17
0.50 BSC
1.05
1.00
0.95
0.15
0.05
0.75
0.60
0.45
SEATING
PLANE
1.20
MAX
1
25
26
50
76
100
75
51
6.50
NOM
3.5°
COPLANARITY
0.08
0.20
0.09
(PINS DOWN)
BOTTOM VIEW
HEAT SINK
Figure 70. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD9444BSVZ-80
1
AD9444-CMOS/PCB
AD9444-LVDS/PCB
Temperature Range
–40°C to +85°C
Package Description
100-Lead TQFP_EP
CMOS Mode Evaluation Board
LVDS Mode Evaluation Board
Package Outline
SV-100-1
1
Z = Pb-free part.
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