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參數(shù)資料
| 型號(hào)： | AD8375ACPZ-R7 |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 21/24頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP VGA DIFF ULDIST 24LFCSP |
| 產(chǎn)品培訓(xùn)模塊： | Differential Circuit Design Techniques for Communication Applications |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 放大器類(lèi)型： | 可變?cè)鲆?br> |
| 電路數(shù)： | 1 |
| 輸出類(lèi)型： | 差分 |
| 轉(zhuǎn)換速率： | 5000 V/µs |
| -3db帶寬： | 630MHz |
| 電流 - 輸入偏壓： | 900nA |
| 電流 - 電源： | 125mA |
| 電壓 - 電源，單路/雙路(±)： | 4.5 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 24-VFQFN 裸露焊盤(pán)，CSP |
| 供應(yīng)商設(shè)備封裝： | 24-LFCSP-VQ（4x4） |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 產(chǎn)品目錄頁(yè)面： | 775 (CN2011-ZH PDF) |
| 其它名稱(chēng)： | AD8375ACPZ-R7DKR |
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AD8375
Data Sheet
Rev. A | Page 6 of 24
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PIN 1
INDICATOR
1
VCOM
2
VIN+
3
VIN–
4
A4
5
A3
6
A2
15 VOUT+
16 VOUT–
17 VOUT+
18 VOUT–
14 COMM
13 VPOS
7
A
1
8
A
0
9
V
P
O
S
1
C
O
M
1
2
V
P
O
S
1
0
V
P
O
S
2
1
C
O
M
2
C
O
M
2
3
V
P
O
S
2
4
C
O
M
2
0
C
O
M
1
9
P
W
U
P
0
6
72
4-
0
02
AD8375
TOP VIEW
(Not to Scale)
NOTES
1. THE EXPOSED PAD IS INTERNALLY CONNECTED TO GROUND.
SOLDER TO A LOW IMPEDANCE GROUND PLANE.
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
VCOM
Common-Mode Pin. Typically bypassed to ground using external capacitor.
2
VIN+
Voltage Input Positive.
3
VIN
Voltage Input Negative.
4
A4
MSB for the 5-Bit Gain Control Interface.
5
A3
MSB 1 for the Gain Control Interface.
6
A2
MSB 2 for the Gain Control Interface.
7
A1
LSB + 1 for the Gain Control Interface.
8
A0
LSB for the 5-Bit Gain Control Interface.
9, 10, 12, 13, 23
VPOS
Positive Supply Pins. Should be bypassed to ground using suitable bypass capacitor.
11, 14, 20, 21, 22, 24
COMM
Device Common (DC Ground).
15, 17
VOUT+
Positive Output Pins (Open Collector). Require dc bias of +5 V nominal.
16, 18
VOUT
Negative Output Pins (Open Collector). Require dc bias of +5 V nominal.
19
PWUP
Chip Enable Pin. Enabled with a logic high and disabled with a logic low.
EPAD
Exposed Pad. The Exposed Pad is internally connected to ground. Solder to a low impedance
ground plane.
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