參數(shù)資料
型號(hào): AD7822BRZ-REEL7
廠商: Analog Devices Inc
文件頁(yè)數(shù): 14/28頁(yè)
文件大?。?/td> 0K
描述: IC ADC 8BIT 1CH 2MSPS 20-SOIC
標(biāo)準(zhǔn)包裝: 1
位數(shù): 8
采樣率(每秒): 2M
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 36mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 20-SOIC W
包裝: 標(biāo)準(zhǔn)包裝
輸入數(shù)目和類型: 1 個(gè)單端,單極
產(chǎn)品目錄頁(yè)面: 779 (CN2011-ZH PDF)
其它名稱: AD7822BRZ-REEL7DKR
AD7822/AD7825/AD7829
Rev. C | Page 21 of 28
COMPLIANT TO JEDEC STANDARDS MO-153-AC
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
Figure 34. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
COMPLIANT TO JEDEC STANDARDS MS-001-AF
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
24
1
12
13
0.100 (2.54)
BSC
1.280 (32.51)
1.250 (31.75)
1.230 (31.24)
PIN 1
0.210
(5.33)
MAX
SEATING
PLANE
0.015
(0.38)
MIN
0.005 (0.13)
MIN
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
0.060 (1.52)
MAX
0.430 (10.92)
MAX
0.014 (0.36)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.015 (0.38)
GAUGE
PLANE
0.195 (4.95)
0.130 (3.30)
0.115 (2.92)
Figure 35. 24-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-24-1)
Dimensions shown in inches and (millimeters)
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