
AD5441
Rev. A | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
VDD to GND
0.3 V, +8 V
VREF to GND
±18 V
RFB to GND
±18 V
Logic Inputs to GND
0.3 V, VDD + 0.3 V
IOUT to GND
0.3 V, VDD + 0.3 V
IOUT Short Circuit to GND
50 mA
Package Power Dissipation
(TJ max TA)/θJA
Maximum Junction Temperature (TJ max)
150°C
Operating Temperature Range
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Lead Temperature (Soldering, 10 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5.
Package Type
θJA
θJC
Unit
8-Lead MSOP
142
44
°C/W
75
18
°C/W
1 Exposed pad soldered to the ground plane.
ESD CAUTION