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| 型號： | AD5422BCPZ-REEL |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | DAC |
| 英文描述： | SERIAL INPUT LOADING, 32 us SETTLING TIME, 16-BIT DAC, QCC40 |
| 封裝： | 6 X 6 MM, ROHS COMPLIANT, MO-220VJJD-2, LFCSP-40 |
| 文件頁數(shù)： | 30/40頁 |
| 文件大小： | 1323K |
| 代理商： | AD5422BCPZ-REEL |
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AD5412/AD5422
Rev. C | Page 36 of 40
The power supply lines of the AD5412/AD5422 should use as
large a trace as possible to provide low impedance paths and
reduce the effects of glitches on the power supply line. Fast
switching signals such as clocks should be shielded with a
digital ground to avoid radiating noise to other parts of the
board. Never run these near the reference inputs. A ground line
routed between the SDIN and SCLK lines helps reduce crosstalk
between them (this is not required on a multilayer board that
has a separate ground plane, but separating the lines helps). It
is essential to minimize noise on the REFIN line because it
couples through to the DAC output.
Avoid crossover of digital and analog signals. Traces on
opposite sides of the PCB should run at right angles to each
other. This reduces the effects of feed through the board. A
microstrip technique is by far the best but not always possible
with a double-sided board. In this technique, the component
side of the board is dedicated to the ground plane, and signal
traces are placed on the solder side.
THERMAL AND SUPPLY CONSIDERATIONS
The AD5412/AD5422 are designed to operate at a maximum
junction temperature of 125°C. It is important that the devices
not be operated under conditions that cause the junction
temperature to exceed this value. Excessive junction tempera-
ture can occur if the AD5412/AD5422 are operated from the
maximum AVDD while driving the maximum current (24 mA)
directly to ground. In this case, control the ambient temperature
or reduce AVDD. The conditions depend on the device package.
At the maximum ambient temperature of 85°C, the 24-lead
TSSOP package can dissipate 950 mW, and the 40-lead LFCSP
package can dissipate 1.42 W.
To ensure that the junction temperature does not exceed 125°C
while driving the maximum current of 24 mA directly into
ground (also adding an on-chip current of 3 mA), reduce AVDD
from the maximum rating to ensure that the package is not
required to dissipate more power than previously stated (see
0
0.5
1.0
1.5
2.0
2.5
40
45
50
55
60
65
70
75
80
85
AMBIENT TEMPERATURE (°C)
PO
W
E
R
D
ISSI
P
A
T
IO
N
(
W
)
LFCSP
TSSOP
06
99
6-
0
66
Figure 75. Maximum Power Dissipation vs. Ambient Temperature
25
27
29
31
33
35
37
39
41
43
45
25
35
45
55
65
75
85
AMBIENT TEMPERATURE (°C)
SU
P
PL
Y
VO
L
T
A
G
E
(
V)
06
99
6-
0
67
TSSOP
LFCSP
Figure 76. Maximum Supply Voltage vs. Ambient Temperature
Table 25. Thermal and Supply Considerations for Each Package
Considerations
TSSOP
LFCSP
Maximum Allowed Power
Dissipation When Operating
at an Ambient Temperature
of 85°C
mW
950
42
85
125
=
=
JA
A
J
T
max
T
θ
W
42
.
1
28
85
125
=
=
JA
A
J
T
max
T
θ
Maximum Allowed Ambient
Temperature When
Operating from a Supply of
40 V and Driving 24 mA
Directly to Ground
C
78
42
)
028
.
0
40
(
125
°
=
×
=
×
JA
D
J
P
max
T
θ
C
94
28
)
028
.
0
40
(
125
°
=
×
=
×
JA
D
J
P
max
T
θ
Maximum Allowed Supply
Voltage When Operating at
an Ambient Temperature of
85°C and Driving 24 mA
Directly to Ground
V
34
42
028
.
0
85
125
=
×
=
×
JA
DD
A
J
AI
T
max
T
θ
V
51
28
028
.
0
85
125
=
×
=
×
JA
DD
A
J
AI
T
max
T
θ
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