參數(shù)資料
型號(hào): ACPM-7813-TR1
英文描述: CDMA/AMPS Power Amplifier Module
中文描述: 碼分多址/ AMPS二元功率放大器模塊
文件頁(yè)數(shù): 20/21頁(yè)
文件大?。?/td> 183K
代理商: ACPM-7813-TR1
20
IR Reflow Soldering
Figure 27 is a straight-line
representation of the recom-
mended nominal time-tempera-
ture profile from JESD22-A113-B
IR reflow.
Figure 27. Time-temperature Profile for IR Reflow Soldering Process.
Table 2. IR Reflow Process Zone.
Process Zone
Temperature
Temperature/
Time
Preheat Zone
25
°
C to 100
°
C
3
°
C/s MAX
Soak Zone
100
°
C to 150
°
C
0.5
°
C/s MAX (120s MAX)
Reflow Zone
150
°
C to 235
°
C (240
°
C MAX)
235
°
C to 150
°
C
4.5
°
C/s TYP
-4.5
°
C/s TYP
Cooling Zone
150
°
C to 25
°
C
-6
°
C/s MAX
Table 3. Classification Reflow Profiles.
Convection or IR/Convection
Average ramp-up rate (183
°
C to peak)
3
°
C/second max.
Preheat temperature 125 (
±
25)
°
C
120 seconds max.
Temperature maintained above 183
°
C
60 – 150 seconds
Time within 5
°
C of actual peak temperature
10 – 20 seconds
Peak temperature range
220 +5/-0
°
C or 235 +5/-0
°
C
Ramp-down rate
6
°
C/second max.
Time 25
°
C to peak temperature
6 minutes max.
Note:
All temperatures measured refer to the package body surface.
TIME (seconds)
T
°
C
0
50
150
100
200
183
235
60
90
30
120
150
210
180
270
300
240
60 to 150s
above 183
°
C
Cooling
Zone
Reflow
Zone
Soak
Zone
Preheat
Zone
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