EQ 2-14 where: EQ 2-15 A heat sink wi" />
參數(shù)資料
型號: A54SX08A-1FG144
廠商: Microsemi SoC
文件頁數(shù): 36/108頁
文件大小: 0K
描述: IC FPGA SX 12K GATES 144-FBGA
標準包裝: 160
系列: SX-A
LAB/CLB數(shù): 768
輸入/輸出數(shù): 111
門數(shù): 12000
電源電壓: 2.25 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 144-LBGA
供應商設備封裝: 144-FPBGA(13x13)
SX-A Family FPGAs
v5.3
2-13
To determine the heat sink's thermal performance, use the following equation:
EQ 2-14
where:
EQ 2-15
A heat sink with a thermal resistance of 9.76°C/W or better should be used. Thermal resistance of heat sinks is a
function of airflow. The heat sink performance can be significantly improved with the presence of airflow.
Carefully estimating thermal resistance is important in the long-term reliability of an Actel FPGA. Design engineers
should always correlate the power consumption of the device with the maximum allowable power dissipation of the
package selected for that device, using the provided thermal resistance data.
Note: The values may vary depending on the application.
θ
JA(TOTAL)
θ
JC
θ
CS
θ
SA
++
=
θ
CS =
0.37°C/W
=
thermal resistance of the interface material between the case and the heat
sink, usually provided by the thermal interface manufacturer
θ
SA =
thermal resistance of the heat sink in °C/W
θ
SA
θ
JA(TOTAL)
θ
JC
θ
CS
=
θ
SA
13.33
°C/W 3.20°C/W
0.37
°C/W
=
θ
SA
9.76
°C/W
=
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相關代理商/技術參數(shù)
參數(shù)描述
A54SX08A-1FG144I 功能描述:IC FPGA SX 12K GATES 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:SX-A 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
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