CMOS Output Module Timing5 t" />
鍙冩暩(sh霉)璩囨枡
鍨嬭櫉锛� A40MX04-3PL68
寤犲晢锛� Microsemi SoC
鏂囦欢闋佹暩(sh霉)锛� 98/142闋�
鏂囦欢澶�?銆�?/td> 0K
鎻忚堪锛� IC FPGA MX SGL CHIP 6K 68-PLCC
妯�(bi膩o)婧�(zh菙n)鍖呰锛� 19
绯诲垪锛� MX
杓稿叆/杓稿嚭鏁�(sh霉)锛� 57
闁€鏁�(sh霉)锛� 6000
闆绘簮闆诲锛� 3 V ~ 3.6 V锛�4.75 V ~ 5.25 V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
宸ヤ綔婧害锛� 0°C ~ 70°C
灏佽/澶栨锛� 68-LCC锛圝 褰㈠紩绶氾級
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 68-PLCC锛�24.23x24.23锛�
绗�1闋�绗�2闋�绗�3闋�绗�4闋�绗�5闋�绗�6闋�绗�7闋�绗�8闋�绗�9闋�绗�10闋�绗�11闋�绗�12闋�绗�13闋�绗�14闋�绗�15闋�绗�16闋�绗�17闋�绗�18闋�绗�19闋�绗�20闋�绗�21闋�绗�22闋�绗�23闋�绗�24闋�绗�25闋�绗�26闋�绗�27闋�绗�28闋�绗�29闋�绗�30闋�绗�31闋�绗�32闋�绗�33闋�绗�34闋�绗�35闋�绗�36闋�绗�37闋�绗�38闋�绗�39闋�绗�40闋�绗�41闋�绗�42闋�绗�43闋�绗�44闋�绗�45闋�绗�46闋�绗�47闋�绗�48闋�绗�49闋�绗�50闋�绗�51闋�绗�52闋�绗�53闋�绗�54闋�绗�55闋�绗�56闋�绗�57闋�绗�58闋�绗�59闋�绗�60闋�绗�61闋�绗�62闋�绗�63闋�绗�64闋�绗�65闋�绗�66闋�绗�67闋�绗�68闋�绗�69闋�绗�70闋�绗�71闋�绗�72闋�绗�73闋�绗�74闋�绗�75闋�绗�76闋�绗�77闋�绗�78闋�绗�79闋�绗�80闋�绗�81闋�绗�82闋�绗�83闋�绗�84闋�绗�85闋�绗�86闋�绗�87闋�绗�88闋�绗�89闋�绗�90闋�绗�91闋�绗�92闋�绗�93闋�绗�94闋�绗�95闋�绗�96闋�绗�97闋�鐣�(d膩ng)鍓嶇98闋�绗�99闋�绗�100闋�绗�101闋�绗�102闋�绗�103闋�绗�104闋�绗�105闋�绗�106闋�绗�107闋�绗�108闋�绗�109闋�绗�110闋�绗�111闋�绗�112闋�绗�113闋�绗�114闋�绗�115闋�绗�116闋�绗�117闋�绗�118闋�绗�119闋�绗�120闋�绗�121闋�绗�122闋�绗�123闋�绗�124闋�绗�125闋�绗�126闋�绗�127闋�绗�128闋�绗�129闋�绗�130闋�绗�131闋�绗�132闋�绗�133闋�绗�134闋�绗�135闋�绗�136闋�绗�137闋�绗�138闋�绗�139闋�绗�140闋�绗�141闋�绗�142闋�
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 55
CMOS Output Module Timing5
tDLH
Data-to-Pad HIGH
2.4
2.7
3.1
3.6
5.1
ns
tDHL
Data-to-Pad LOW
2.9
3.2
3.6
4.3
6.0
ns
tENZH
Enable Pad Z to HIGH
2.7
2.9
3.3
3.9
5.5
ns
tENZL
Enable Pad Z to LOW
2.9
3.2
3.7
4.3
6.1
ns
tENHZ
Enable Pad HIGH to Z
4.9
5.4
6.2
7.3
10.2
ns
tENLZ
Enable Pad LOW to Z
5.3
5.9
6.7
7.9
11.1
ns
tGLH
G-to-Pad HIGH
4.2
4.6
5.2
6.1
8.6
ns
tGHL
G-to-Pad LOW
4.2
4.6
5.2
6.1
8.6
ns
tLSU
I/O Latch Set-Up
0.5
0.6
0.7
1.0
ns
tLH
I/O Latch Hold
0.0
ns
tLCO
I/O Latch Clock-to-Out
(Pad-to-Pad), 64 Clock Loading
5.2
5.8
6.6
7.7
10.8
ns
tACO
Array Clock-to-Out (
Pad-to-Pad), 64 Clock Loading
7.4
8.2
9.3
10.9
15.3
ns
dTLH
Capacity Loading, LOW to HIGH
0.03
0.04
0.06 ns/pF
dTHL
Capacity Loading, HIGH to LOW
0.04
0.05
0.07 ns/pF
Table 1-32 A42MX09 Timing Characteristics (Nominal 5.0 V Operation) (continued)
(Worst-Case Commercial Conditions, VCCA = 4.75 V, TJ = 70掳C)
鈥�3 Speed
鈥�2 Speed
鈥�1 Speed
Std Speed
鈥揊 Speed
Units
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External
setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external
PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
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