tINYH Pad-to-Y HIGH " />
鍙冩暩(sh霉)璩囨枡
鍨嬭櫉(h脿o)锛� A40MX02-1VQ80
寤犲晢锛� Microsemi SoC
鏂囦欢闋�(y猫)鏁�(sh霉)锛� 105/142闋�(y猫)
鏂囦欢澶�?銆�?/td> 0K
鎻忚堪锛� IC FPGA MX SGL CHIP 3K 80-VQFP
妯�(bi膩o)婧�(zh菙n)鍖呰锛� 90
绯诲垪锛� MX
杓稿叆/杓稿嚭鏁�(sh霉)锛� 57
闁€鏁�(sh霉)锛� 3000
闆绘簮闆诲锛� 3 V ~ 3.6 V锛�4.75 V ~ 5.25 V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
宸ヤ綔婧害锛� 0°C ~ 70°C
灏佽/澶栨锛� 80-TQFP
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 80-VQFP锛�14x14锛�
绗�1闋�(y猫)绗�2闋�(y猫)绗�3闋�(y猫)绗�4闋�(y猫)绗�5闋�(y猫)绗�6闋�(y猫)绗�7闋�(y猫)绗�8闋�(y猫)绗�9闋�(y猫)绗�10闋�(y猫)绗�11闋�(y猫)绗�12闋�(y猫)绗�13闋�(y猫)绗�14闋�(y猫)绗�15闋�(y猫)绗�16闋�(y猫)绗�17闋�(y猫)绗�18闋�(y猫)绗�19闋�(y猫)绗�20闋�(y猫)绗�21闋�(y猫)绗�22闋�(y猫)绗�23闋�(y猫)绗�24闋�(y猫)绗�25闋�(y猫)绗�26闋�(y猫)绗�27闋�(y猫)绗�28闋�(y猫)绗�29闋�(y猫)绗�30闋�(y猫)绗�31闋�(y猫)绗�32闋�(y猫)绗�33闋�(y猫)绗�34闋�(y猫)绗�35闋�(y猫)绗�36闋�(y猫)绗�37闋�(y猫)绗�38闋�(y猫)绗�39闋�(y猫)绗�40闋�(y猫)绗�41闋�(y猫)绗�42闋�(y猫)绗�43闋�(y猫)绗�44闋�(y猫)绗�45闋�(y猫)绗�46闋�(y猫)绗�47闋�(y猫)绗�48闋�(y猫)绗�49闋�(y猫)绗�50闋�(y猫)绗�51闋�(y猫)绗�52闋�(y猫)绗�53闋�(y猫)绗�54闋�(y猫)绗�55闋�(y猫)绗�56闋�(y猫)绗�57闋�(y猫)绗�58闋�(y猫)绗�59闋�(y猫)绗�60闋�(y猫)绗�61闋�(y猫)绗�62闋�(y猫)绗�63闋�(y猫)绗�64闋�(y猫)绗�65闋�(y猫)绗�66闋�(y猫)绗�67闋�(y猫)绗�68闋�(y猫)绗�69闋�(y猫)绗�70闋�(y猫)绗�71闋�(y猫)绗�72闋�(y猫)绗�73闋�(y猫)绗�74闋�(y猫)绗�75闋�(y猫)绗�76闋�(y猫)绗�77闋�(y猫)绗�78闋�(y猫)绗�79闋�(y猫)绗�80闋�(y猫)绗�81闋�(y猫)绗�82闋�(y猫)绗�83闋�(y猫)绗�84闋�(y猫)绗�85闋�(y猫)绗�86闋�(y猫)绗�87闋�(y猫)绗�88闋�(y猫)绗�89闋�(y猫)绗�90闋�(y猫)绗�91闋�(y猫)绗�92闋�(y猫)绗�93闋�(y猫)绗�94闋�(y猫)绗�95闋�(y猫)绗�96闋�(y猫)绗�97闋�(y猫)绗�98闋�(y猫)绗�99闋�(y猫)绗�100闋�(y猫)绗�101闋�(y猫)绗�102闋�(y猫)绗�103闋�(y猫)绗�104闋�(y猫)鐣�(d膩ng)鍓嶇105闋�(y猫)绗�106闋�(y猫)绗�107闋�(y猫)绗�108闋�(y猫)绗�109闋�(y猫)绗�110闋�(y猫)绗�111闋�(y猫)绗�112闋�(y猫)绗�113闋�(y猫)绗�114闋�(y猫)绗�115闋�(y猫)绗�116闋�(y猫)绗�117闋�(y猫)绗�118闋�(y猫)绗�119闋�(y猫)绗�120闋�(y猫)绗�121闋�(y猫)绗�122闋�(y猫)绗�123闋�(y猫)绗�124闋�(y猫)绗�125闋�(y猫)绗�126闋�(y猫)绗�127闋�(y猫)绗�128闋�(y猫)绗�129闋�(y猫)绗�130闋�(y猫)绗�131闋�(y猫)绗�132闋�(y猫)绗�133闋�(y猫)绗�134闋�(y猫)绗�135闋�(y猫)绗�136闋�(y猫)绗�137闋�(y猫)绗�138闋�(y猫)绗�139闋�(y猫)绗�140闋�(y猫)绗�141闋�(y猫)绗�142闋�(y猫)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 61
Input Module Propagation Delays
tINYH
Pad-to-Y HIGH
1.1
1.2
1.3
1.6
2.2
ns
tINYL
Pad-to-Y LOW
0.8
0.9
1.0
1.2
1.7
ns
tINGH
G to Y HIGH
1.4
1.6
1.8
2.1
2.9
ns
tINGL
G to Y LOW
1.4
1.6
1.8
2.1
2.9
ns
Input Module Predicted Routing Delays2
tIRD1
FO = 1 Routing Delay
1.8
2.0
2.3
2.7
4.0
ns
tIRD2
FO = 2 Routing Delay
2.1
2.3
2.6
3.1
4.3
ns
tIRD3
FO = 3 Routing Delay
2.3
2.6
3.0
3.5
4.9
ns
tIRD4
FO = 4 Routing Delay
2.6
3.0
3.3
3.9
5.4
ns
tIRD8
FO = 8 Routing Delay
3.6
4.0
4.6
5.4
7.5
ns
Global Clock Network
tCKH
Input LOW to HIGH
FO = 32
FO = 384
2.6
2.9
3.2
3.3
3.6
3.9
4.3
5.4
6.0
ns
tCKL
Input HIGH to LOW
FO = 32
FO = 384
3.8
4.5
4.2
5.0
4.8
5.6
6.6
7.8
9.2
ns
tPWH
Minimum Pulse Width
HIGH
FO = 32
FO = 384
3.2
3.7
3.5
4.1
4.0
4.6
4.7
5.4
6.6
7.6
ns
tPWL
Minimum Pulse Width
LOW
FO = 32
FO = 384
3.2
3.7
3.5
4.1
4.0
4.6
4.7
5.4
6.6
7.6
ns
tCKSW
Maximum Skew
FO = 32
FO = 384
0.3
0.4
0.5
0.7
ns
tSUEXT
Input Latch External
Set-Up
FO = 32
FO = 384
0.0
ns
tHEXT
Input Latch External
Hold
FO = 32
FO = 384
2.8
3.2
3.1
3.5
5.5
4.0
4.1
4.7
5.7
6.6
ns
tP
Minimum Period
FO = 32
FO = 384
4.2
4.6
4.67
5.1
5.6
5.8
6.4
9.7
10.7
ns
fMAX
Maximum Frequency FO = 32
FO = 384
237
215
195
198
179
172
156
103
94
MHz
Table 1-34 A42MX16 Timing Characteristics (Nominal 5.0 V Operation) (continued)
(Worst-Case Commercial Conditions, VCCA = 4.75 V, TJ = 70掳C)
鈥�3 Speed
鈥�2 Speed
鈥�1 Speed
Std Speed
鈥揊 Speed
Units
Parameter / Description
Min. Max. Min. Max.
Min. Max. Min. Max. Min. Max.
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, point and position whichever is
appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External
setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external
PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
鐩搁棞(gu膩n)PDF璩囨枡
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鐩搁棞(gu膩n)浠ｇ悊鍟�/鎶€琛�(sh霉)鍙冩暩(sh霉)
鍙冩暩(sh霉)鎻忚堪
A40MX02-1VQ80I 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 3K 80-VQFP RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫�(ch菐ng)鍙法绋嬮杸闄ｅ垪锛� 绯诲垪:MX 妯�(bi膩o)婧�(zh菙n)鍖呰:90 绯诲垪:ProASIC3 LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�(j矛):36864 杓稿叆/杓稿嚭鏁�(sh霉):157 闁€鏁�(sh霉):250000 闆绘簮闆诲:1.425 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 125°C 灏佽/澶栨:256-LBGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:256-FPBGA锛�17x17锛�
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A40MX02-1VQG80I 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 3K 80-VQFP RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫�(ch菐ng)鍙法绋嬮杸闄ｅ垪锛� 绯诲垪:MX 妯�(bi膩o)婧�(zh菙n)鍖呰:90 绯诲垪:ProASIC3 LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�(j矛):36864 杓稿叆/杓稿嚭鏁�(sh霉):157 闁€鏁�(sh霉):250000 闆绘簮闆诲:1.425 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 125°C 灏佽/澶栨:256-LBGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:256-FPBGA锛�17x17锛�
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