A3 21 00 DX Ti m i n g Ch ar ac te r i st i c s (continued) (Wors" />
參數(shù)資料
型號: A1020B-PQG100C
廠商: Microsemi SoC
文件頁數(shù): 47/98頁
文件大小: 0K
描述: IC FPGA 2K GATES 100-PQFP COM
標(biāo)準(zhǔn)包裝: 66
系列: ACT™ 1
LAB/CLB數(shù): 547
輸入/輸出數(shù): 69
門數(shù): 2000
電源電壓: 4.5 V ~ 5.5 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 100-BQFP
供應(yīng)商設(shè)備封裝: 100-PQFP(14x20)
51
Hi R e l F P GA s
A3 21 00 DX Ti m i n g Ch ar ac te r i st i c s (continued)
(Wors t-C ase Mi litary Conditions , V CC = 4.5V, TJ = 125°C)
‘–1’ Speed
‘Std’ Speed
Parameter
Description
Min.
Max.
Min.
Max.
Units
TTL Output Module Timing1
tDLH
Data to Pad High
5.1
6.8
ns
tDHL
Data to Pad Low
6.3
8.3
ns
tENZH
Enable Pad Z to High
6.6
8.8
ns
tENZL
Enable Pad Z to Low
7.1
9.4
ns
tENHZ
Enable Pad High to Z
11.5
15.3
ns
tENLZ
Enable Pad Low to Z
11.5
15.3
ns
tGLH
G to Pad High
11.5
15.3
ns
tGHL
G to Pad Low
12.4
16.6
ns
tLSU
I/O Latch Output Setup
0.4
0.5
ns
tLH
I/O Latch Output Hold
0.0
ns
tLCO
I/O Latch Clock-Out (Pad-to-Pad) 32 I/O
11.5
15.4
ns
tACO
Array Latch Clock-Out (Pad-to-Pad) 32 I/O
16.3
21.7
ns
dTLH
Capacitive Loading, Low to High
0.04
0.06
ns/pF
dTHL
Capacitive Loading, High to Low
0.06
0.08
ns/pF
tWDO
Hard-Wired Wide Decode Output
0.05
0.07
ns
CMOS Output Module Timing1
tDLH
Data to Pad High
6.3
8.3
ns
tDHL
Data to Pad Low
5.1
6.8
ns
tENZH
Enable Pad Z to High
6.6
8.8
ns
tENZL
Enable Pad Z to Low
7.1
9.4
ns
tENHZ
Enable Pad High to Z
11.5
15.3
ns
tENLZ
Enable Pad Low to Z
11.5
15.3
ns
tGLH
G to Pad High
11.5
15.3
ns
tGHL
G to Pad Low
12.4
16.6
ns
tLSU
I/O Latch Setup
0.4
0.5
ns
tLH
I/O Latch Hold
0.0
ns
tLCO
I/O Latch Clock-Out (Pad-to-Pad) 32 I/O
13.7
18.2
ns
tACO
Array Latch Clock-Out (Pad-to-Pad) 32 I/O
19.2
25.6
ns
dTLH
Capacitive Loading, Low to High
0.06
0.08
ns/pF
dTHL
Capacitive Loading, High to Low
0.05
0.07
ns/pF
tWDO
Hard-Wired Wide Decode Output
0.05
0.07
ns
Notes:
1.
Delays based on 35 pF loading.
2.
SSO information can be found in the Simultaneously Switching Output Limits for Actel FPGAs application note at
http://www.actel.com/appnotes.
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