
50
A3 21 00 DX Ti m i n g Ch ar ac te r i st i c s (continued)
(Wor s t - C as e M i l i t a r y Cond i t i o n s , V CC = 4.5 V, TJ = 1 25°C)
‘–1’ Speed
‘Std’ Speed
Parameter
Description
Min.
Max.
Min.
Max.
Units
Input Module Propagation Delays
tINPY
Input Data Pad to Y
1.9
2.6
ns
tINGO
Input Latch Gate-to-Output
4.0
5.3
ns
tINH
Input Latch Hold
0.0
ns
t
Input Latch Setup
0.7
0.9
ns
tILA
Latch Active Pulse Width
6.1
8.1
ns
Input Module Predicted Routing Delays1
tIRD1
FO=1 Routing Delay
2.2
2.9
ns
tIRD2
FO=2 Routing Delay
2.8
3.8
ns
tIRD3
FO=3 Routing Delay
3.5
4.7
ns
tIRD4
FO=4 Routing Delay
3.5
4.7
ns
tIRD8
FO=8 Routing Delay
5.6
7.5
ns
Global Clock Network
tCKH
Input Low to High
FO=32
FO=635
6.5
7.9
8.7
10.6
ns
tCKL
Input High to Low
FO=32
FO=635
6.6
8.8
11.8
ns
tPWH
Minimum Pulse Width High
FO=32
FO=635
4.1
4.6
5.5
6.1
ns
tPWL
Minimum Pulse Width Low
FO=32
FO=635
4.1
4.6
5.5
6.1
ns
tCKSW
Maximum Skew
FO=32
FO=635
1.8
2.4
ns
tSUEXT
Input Latch External Setup
FO=32
FO=635
0.0
ns
tHEXT
Input Latch External Hold
FO=32
FO=635
3.0
3.8
4.0
5.1
ns
tP
Minimum Period (1/fmax)
FO=32
FO=635
7.1
7.9
9.5
10.5
ns
fHMAX
Maximum Datapath Frequency
FO=32
FO=635
140
126
105
95
MHz
Note:
1.
Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device
performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route timing is
based on actual routing delay measurements performed on the device prior to shipment. Optimization techniques may further reduce
delays by 0 to 4 ns.