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參數(shù)資料
| 型號： | 935271490512 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 4 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQCC68 |
| 封裝： | PLASTIC, MS-018, SOT-188-2, LCC-68 |
| 文件頁數(shù)： | 46/56頁 |
| 文件大小： | 715K |
| 代理商： | 935271490512 |
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Philips Semiconductors
SC16C554/554D
Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
Product data
Rev. 02 — 13 March 2003
50 of 53
9397 750 11002
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
For packages with leads on four sides, the footprint must be placed at a 45
° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250
°C. A mildly-activated ux will eliminate the
need for removal of corrosive residues in most applications.
12.4 Manual soldering
Fix the component by rst soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the at part of the lead. Contact time
must be limited to 10 seconds at up to 300
°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°C.
12.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the
(LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales ofce.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
[3]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[4]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[5]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[6]
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Table 28:
Suitability of surface mount IC packages for wave and reow soldering
methods
Package[1]
Soldering method
Wave
Reow[2]
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP, HVQFN, HVSON,
SMS
not suitable[3]
suitable
PLCC[4], SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended[4][5]
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended[6]
suitable
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