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參數(shù)資料
| 型號： | 935267050025 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, UUC |
| 封裝： | WAFER |
| 文件頁數(shù)： | 9/23頁 |
| 文件大小： | 331K |
| 代理商： | 935267050025 |
January 2005
Page 17 of 23
Public
14 Hints for Label IC Encapsulation
14.1 Protection against Visible Light
As a result of the ultra low power design of the ICODE1 Label IC some analogue circuits on the
chip are light sensitive. This means that common sun light can impact the operation of the label if
the chip is not protected against visible light radiation.
Measurements have shown that a radiation of Emax = 60 W/m
2 (spectrum: 400 to 1000 nm) causes a
reduced operating range of the plain chip.
Measurements of direct sunlight in summer deliver values up to 260 W/m
2.
To ensure proper operation an expected minimum radiation reduction factor of approx. 9
(2 x 260/60 = 8.7) must be provided by the encapsulation. That means special care has to be taken
to ensure a sufficient light protection of the ICODE1 Label IC (e.g. non translucent encapsulation
or underfiller, ...) according to application requirements.
14.2 Protection against UV Light
An EEPROM memory, as it is also used in the ICODE1 Label IC, has some principle sensitivity to
UV light (applies to EEPROM-technology in general).
Thus strong UV exposure in the production of inlets/labels has to be avoided. UV protection has to
be ensured using appropriate assembly methods.
14.3 Resistance to X-Rays
X-ray exposure on comparable Philips ICs (with even smaller feature size) caused neither a long
term influence on the behaviour of the ICs nor on the data retention of the EEPROMs.
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