參數(shù)資料
型號(hào)： 935267050025
廠商： NXP SEMICONDUCTORS
元件分類(lèi)： 消費(fèi)家電
英文描述： SPECIALTY CONSUMER CIRCUIT, UUC
封裝： WAFER
文件頁(yè)數(shù)： 3/23頁(yè)
文件大?。?/td> 331K
代理商： 935267050025
January 2005
Page 11 of 23
Public
7 Mechanical Wafer Specifications
For further information as described in the following chapters please refer to the following
Philips documents:
Dicing Guidelines for Thin Wafers (< 200 m)
General Specification for 6” Wafer
In case of doubt or inconsistency with the following chapters the above mentioned specifications
are applicable.
Designation:
each wafer is laser scribed with batch and wafer number
Wafer diameter:
150 mm (6")
± 0.3 mm
Die separation lane width:
80 m (Scribe line)
Electrical connection of substrate:
VSS
Geometrically complete dies per wafer:
approx. 7400
Orientation of dies relat. to wafer flat:
see attached cluster map
Position of test structures:
see attached cluster map
Wafer layout:
see attached cluster map
Batch size:
24 wafers
Process:
6C15 IDFW
7.1 Wafer Status
Tested, unsawn
Tested, sawn on FFC
Minimum yield per lot:
30 %
7.2 Backside Treatment
Wafers can be delivered with a thickness of 150
m ± 15 m (approx. 6 mil) and have a ground and
etched backside.
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