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參數(shù)資料
| 型號(hào)： | 935264467005 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費(fèi)家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, UUC |
| 封裝： | WAFER |
| 文件頁數(shù)： | 7/24頁 |
| 文件大小： | 341K |
| 代理商： | 935264467005 |
1 Chip Specification
Rev. 2.2
January 2005
SL044022.doc/B
Public
Page 15 of 24
11 Packing
The packing for shipment of wafers has to protect the wafers against shock, severe impact, dust and
electrostatic discharge. The packing of unsawn wafers or sawn wafers is done according to Philips
‘General Specification for 6” Wafer’.
11.1 Storage Recommendations
Sawn wafers should be kept in their original packing whilst in storage.
Recommended storage conditions:
Temperature:
15 ... 25 °C
Climate atmosphere:
40 ... 60 % r.h. or dried N2 (only unsawn wafers!)
Duration of storage:
max. 6 months
Deviating requirements have to be arranged between customer and Philips Semiconductors.
11.2 Possible Forms of Delivery
11.2.1 Packing of Sawn Wafers
Delivery form:
Film Frame Carrier (standard Philips carrier type P7)
Foil thickness:
0.55 ... 0.85 mm
Foil material:
sticky foil
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