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參數(shù)資料
| 型號： | 935263381025 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, UUC29 |
| 封裝： | DIE-29 |
| 文件頁數(shù)： | 12/31頁 |
| 文件大?。?/td> | 224K |
| 代理商： | 935263381025 |
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1999 Nov 03
2
Philips Semiconductors
Product specication
SDH/SONET STM4/OC12 and
1.25 Gbits/s Gigabit Ethernet postampliers
TZA3044; TZA3044B
FEATURES
Pin compatible with the NE/SA5224 and NE/SA5225 but
with extended power supply range and less external
component count
Wideband operation from 1.0 kHz to 1.25 GHz typical
Applicable in 622 Mbits/s SDH/SONET receivers and
1.25 Gbits/s Gigabit Ethernet receivers
Single supply voltage from 3.0 to 5.5 V
Positive Emitter Coupled Logic (PECL) compatible data
outputs
Positive Emitter Coupled Logic (PECL) compatible
status outputs (TTL compatible status outputs for the
TZA3044B)
Programmable input signal level detection to be
adjusted using a single external resistor
On-chip DC offset compensation without external
capacitor.
APPLICATIONS
Digital fibre optic receiver for SDH/SONET STM4/OC12
and Gigabit Ethernet applications
Wideband RF gain block.
GENERAL DESCRIPTION
The TZA3044 is a high gain limiting amplifier that is
designed to process signals from fibre optic preamplifiers
like the TZA3043 and TZA3023. It is pin compatible with
the NE/SA5224 and NE/SA5225 but with extended power
supply range, and needs less external components.
Capable of operating up to 1.25 Gbits/s, the chip has input
signal level detection with a user-programmable threshold.
The data and level detection status outputs are differential
outputs for optimum noise margin and ease of use.
The TZA3044B has the same functionality as the
TZA3044, but with TTL compatible status outputs
(pins ST and STQ), and TTL compatible JAM input.
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TZA3044T
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
TZA3044TT
TSSOP16
plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
TZA3044U
bare die in wafe pack carriers; die dimensions 1.55
× 1.55 mm
TZA3044BT
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
TZA3044BTT
TSSOP16
plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
TZA3044BU
bare die in wafe pack carriers; die dimensions 1.55
× 1.55 mm
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