參數(shù)資料
型號(hào)： 935263376025
廠商： NXP SEMICONDUCTORS
元件分類： 通信及網(wǎng)絡(luò)
英文描述： SPECIALTY TELECOM CIRCUIT, UUC13
封裝： DIE-13
文件頁數(shù)： 24/26頁
文件大?。?/td> 258K
代理商： 935263376025
2000 Mar 29
7
Philips Semiconductors
Product specication
SDH/SONET STM4/OC12
transimpedance amplier
TZA3023
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
HANDLING
Precautions should be taken to avoid damage through electrostatic discharge. This is particularly important during
assembly and handling of the bare die. Additional safety can be obtained by bonding the VCC and GND pads first, the
remaining pads may then be bonded to their external connections in any order.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VCC
supply voltage
0.5
+6
V
Vn
DC voltage
pin 3/pad 4: IPhoto
0.5
+1
V
pins 6 and 7/pads 9 and 10: OUT and OUTQ
0.5
VCC + 0.5
V
pad 13: AGC (TZA3023U only)
0.5
VCC + 0.5
V
pin 1/pad 1: DREF
0.5
VCC + 0.5
V
In
DC current
pin 3/pad 4: IPhoto
1
+2.5
mA
pins 6 and 7/pads 9 and 10: OUT and OUTQ
15
+15
mA
pad 13: AGC (TZA3023U only)
0.2
+0.2
mA
pin 1/pad 1: DREF
2.5
+2.5
mA
Ptot
total power dissipation
300
mW
Tstg
storage temperature
65
+150
°C
Tj
junction temperature
125
°C
Tamb
ambient temperature
40
+85
°C
SYMBOL
PARAMETER
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
160
K/W
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