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| 型號(hào)： | 935260218122 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, XMA |
| 封裝： | 11.75 X 7.55 MM, 0.45 MM HEIGHT, MODULE |
| 文件頁數(shù)： | 3/8頁 |
| 文件大?。?/td> | 156K |
| 代理商： | 935260218122 |
Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
Ht1moa3.doc/HS
Page 3 of 24
1 Definitions
1.1 Objective of the Specifications
This specification lists the parameters to be fulfilled by the HITAG 1 chip module
HT1 MOA3 S30 for contactless smart cards or similar transponders (as e.g. discs).
1.2 Definition of the Chip Module
A chip module is an electronically packaged chip covered with a globe top cap. The
HT1 MOA3 S30 is above all used as card module, i.e. for further lamination into contactless
smart cards according to ISO 10536.1.
So the HITAG 1 chip module HT1 MOA3 S30 is best suited for customers that do not want to
spend time with micro assembly and therefore start - e.g. ISO card production - with the
HITAG 1 chip module.
1.3 Use of the Modules
The HITAG 1 modules are designed to be connected to a coil and then to be further processed by
packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing
information for the coil-module connection and packaging is given in the specification.
For production of contactless chip cards it is recommended to prepunch card foils to create a
recess for the chip module in the card body.
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