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參數(shù)資料
| 型號(hào)： | 935260218122 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, XMA |
| 封裝： | 11.75 X 7.55 MM, 0.45 MM HEIGHT, MODULE |
| 文件頁(yè)數(shù)： | 2/8頁(yè) |
| 文件大?。?/td> | 156K |
| 代理商： | 935260218122 |
Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
Ht1moa3.doc/HS
Page 2 of 24
Table of Contents
1 Definitions .............................................................................................................................. 3
1.1 Objective of the Specifications ..................................................................................................................... 3
1.2 Definition of the Chip Module ..................................................................................................................... 3
1.3 Use of the Modules ...................................................................................................................................... 3
2 Specifications ......................................................................................................................... 4
2.1 Mechanical Properties ................................................................................................................................. 4
2.2 Materials ..................................................................................................................................................... 4
2.3 Temperature Range ..................................................................................................................................... 4
2.4 Storage Conditions ...................................................................................................................................... 5
2.5 Delivery Conditions ..................................................................................................................................... 5
2.6 Electrical Specifications............................................................................................................................... 6
3 Drawing of the Chip Module HT1 MOA3 S30..................................................................... 7
3.1 Drawing of the Reel..................................................................................................................................... 7
3.2 Module outline suggestion ........................................................................................................................... 8
3.3 Splicing Specification .................................................................................................................................. 9
4 Coil Specifications................................................................................................................ 10
5 Functional Description of HITAG 1 ................................................................................... 12
5.1 Memory Organization................................................................................................................................ 12
5.2 Anticollision.............................................................................................................................................. 13
5.3 Operation Modes and Configuration .......................................................................................................... 14
5.3.1 Modes of Operation............................................................................................................................ 14
5.3.2 Configuration..................................................................................................................................... 14
5.4 Configuration of Delivered HITAG 1 Transponders................................................................................... 17
5.5 Definition of Keys and Logdata ................................................................................................................. 17
6 Quality Inspection ............................................................................................................... 19
7 Characterisation and Test of the Final Transponder ......................................................... 20
7.1 Characterisation of the Transponder .......................................................................................................... 20
7.2 Final Test of the Transponder .................................................................................................................... 20
8 Ordering Information.......................................................................................................... 21
HITAG
TM is a trademark of Philips Electronics N.V.
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