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| 型號(hào)： | 935260062118 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, XMA |
| 封裝： | 11.75 X 7.55 MM, 0.45 MM HEIGHT, MODULE |
| 文件頁(yè)數(shù)： | 18/22頁(yè) |
| 文件大小： | 161K |
| 代理商： | 935260062118 |
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Specifications of the HT2 MOA3 S20
Rev. 1.1
1997-08-19
Ht2moa3.doc/HS
Page 5 of 22
2.4 Storage Conditions
Temperature
15 - 30 °C
Relative Humidity
40 - 70 %
Duration
1 year
2.5 Delivery Conditions
Delivery Identification
Date of ready for shipment, reel numbers, total quantity of good
modules with the detail of good modules per reel, order number,
product type, no supplier identification on reels, bags and boxes.
Types of Delivery
Chip modules on reel
single chip modules (bulk goods)
approx. 15.000 to 20.000
pcs. per reel,
tape width super 35 mm,
pitch 9,5 mm, 2 rows
500 pcs . per bag
Packing and Transport
According to documentation
"Packing Method Modules (reel)"
"Packing Method Modules (singulated)"
Order-No. 3322 845 04881
Bad Module Marking
All bad modules (mechanical and
electrical faults) must be punched by
reject hole for customer
Bad positions (reel): <20%
see drawings chapter 3
Splicing Specifications
Tape material: adhes. tape 15,5 +/- 0,7
mm, thermal resistance at
<190°C by < 100 cN tractive power and
< 30 sec. duration.
see drawings chapter 3
Labeling
Identification label on the reel and on
carton bag:
- Product type
- Number of the reel
- Total number of positions
- Number of good positions
- Date of sealing (to be checked)
- Two batches per reel only
- Batch number indication (only coded,
to be checked)
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