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Philips Semiconductors
Product specification
74F382
Arithmetic logic unit
1990 Jul 12
7
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free-air temperature range.)
SYMBOL
PARAMETER
RATING
UNIT
V
CC
V
IN
I
IN
V
OUT
Supply voltage
–0.5 to +7.0
V
Input voltage
–0.5 to +7.0
V
Input current
–30 to +1
mA
Voltage applied to output in High output state
–0.5 to +V
CC
V
I
OUT
Current applied to output in Low output state
40
mA
T
amb
T
stg
Operating free-air temperature range
0 to +70
°
C
°
C
Storage temperature range
–65 to +150
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARMETER
LIMITS
UNIT
SYMBOL
MIN
NOM
MAX
V
CC
V
IH
V
IL
I
IK
I
OH
I
OL
T
amb
Supply voltage
4.5
5.0
5.5
V
High-level input voltage
2.0
V
Low-level input voltage
0.8
V
Input clamp current
–18
mA
High-level output current
–1
mA
Low-level output current
20
mA
Operating free-air temperature range
0
70
°
C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST
LIMITS
TYP
2
UNIT
CONDITIONS
1
MIN
MAX
V
OH
High level output voltage
High-level output voltage
V
CC
= MIN, V
IL
= MAX,
±
10%V
CC
2.5
V
V
IH
= MIN, I
OH
= MAX
±
5%V
CC
2.7
3.4
V
V
OL
Low level output voltage
Low-level output voltage
V
CC
= MIN, V
IL
= MAX,
V
IH
= MIN, I
OL
= MAX
V
CC
= MIN, I
I
= I
IK
V
CC
= MAX, V
I
= 7.0V
V
CC
= MAX, V
I
= 2.7V
±
10%V
CC
±
5%V
CC
0.30
0.50
V
0.30
0.50
V
V
IK
I
I
I
IH
Input clamp voltage
–0.73
–1.2
V
μ
A
μ
A
Input current at maximum input voltage
100
High-level input current
20
Cn
–3.0
mA
I
IL
Low-level input current
A0–A3, B0–B3
V
CC
= MAX, V
I
= 0.5V
–2.4
mA
S0, S1, S2
–0.6
mA
I
OS
Short-circuit output current
3
V
CC
= MAX
–60
–150
mA
I
CC
Supply current (total)
V
CC
= MAX
54
81
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
CC
= 5V, T
amb
= 25
°
C.
3. Not more than one output should be shorted at a time. For testing I
OS
, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
OS
tests should be performed last.