
Philips Semiconductors
Product specification
74F256
Dual addressable latch
1988 Nov 29
5
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free air temperature range.)
SYMBOL
PARAMETER
RATING
UNIT
V
CC
Supply voltage
–0.5 to +7.0
V
V
IN
Input voltage
–0.5 to +7.0
V
I
IN
Input current
–30 to +5
mA
V
OUT
Voltage applied to output in High output state
–0.5 to V
CC
V
I
OUT
Current applied to output in Low output state
40
mA
T
amb
Operating free-air temperature range
0 to +70
°
C
°
C
T
stg
Storage temperature range
–65 to +150
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMITS
UNIT
MIN
NOM
MAX
V
CC
Supply voltage
4.5
5.0
5.5
V
V
IH
V
IL
I
IK
I
OH
I
OL
High-level input voltage
2.0
V
Low-level input voltage
0.8
V
Input clamp current
–18
mA
High-level output current
–1
mA
Low-level output current
20
mA
°
C
T
amb
Operating free-air temperature range
0
70
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST
LIMITS
TYP
2
UNIT
CONDITIONS
1
MIN
MAX
V
OH
High-level output voltage
V
CC
= MIN, V
IL
= MAX,
V
IH
= MIN, I
OL
= MAX
V
CC
= MIN, V
IL
= MAX,
V
IH
= MIN, I
OL
= MAX
V
CC
= MIN, I
I
= I
IK
V
CC
= MAX, V
I
= 7.0V
V
CC
= MAX, V
I
= 2.7V
V
CC
= MAX, V
I
= 0.5V
±
10%V
CC
±
5%V
CC
±
10%V
CC
±
5%V
CC
2.5
V
2.7
3.4
V
V
OL
Low-level output voltage
0.35
0.50
V
0.35
0.50
V
V
IK
I
I
I
IH
I
IL
Input clamp voltage
–0.73
-1.2
V
μ
A
μ
A
Input current at maximum input voltage
100
High-level input current
20
Low-level input current
–0.6
mA
I
OS
Short-circuit output current
3
V
CC
= MAX
–60
–150
mA
I
CC
Supply current (total)
I
CCH
I
CCL
V
CC
= MAX
21
42
mA
33
60
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
CC
= 5V, T
amb
= 25
°
C.
3. To reduce the effect of external noise during test.
4. Not more than one output should be shorted at a time. For testing I
OS
, the use of High-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
OS
tests should be performed last.