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參數(shù)資料
| 型號(hào)： | 74ALVC541 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Octal buffer/line driver; 3-state |
| 中文描述： | 八路緩沖器/線路驅(qū)動(dòng)器，3態(tài) |
| 文件頁數(shù)： | 13/16頁 |
| 文件大?。?/td> | 83K |
| 代理商： | 74ALVC541 |
2002 Feb 26
13
Philips Semiconductors
Product specification
Octal buffer/line driver; 3-state
74ALVC541
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74ALVC541BQ | 制造商:NXP Semiconductors 功能描述:IC OCT BUFF/DRV TRI-ST DHV |
| 74ALVC541BQ,115 | 功能描述:緩沖器和線路驅(qū)動(dòng)器 3.3V OCTAL BUFFER RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| 74ALVC541BQ115 | 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| 74ALVC541BQ-G | 功能描述:緩沖器和線路驅(qū)動(dòng)器 3.3V OCTAL BUFFER LINE DRIVER RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| 74ALVC541BQ-Q100X | 功能描述:Buffer, Non-Inverting 1 Element 8 Bit per Element Push-Pull Output 20-DHVQFN (4.5x 2.5) 制造商:nxp semiconductors 系列:汽車級(jí)，AEC-Q100，74ALVC 包裝:帶卷（TR） 零件狀態(tài):有效 邏輯類型:緩沖器，非反向 元件數(shù):1 每元件位數(shù):8 輸入類型:- 輸出類型:推挽式 電流 - 輸出高，低:24mA，24mA 電壓 - 電源:1.65 V ~ 3.6 V 工作溫度:-40°C ~ 85°C（TA） 安裝類型:表面貼裝 封裝/外殼:20-VFQFN 裸露焊盤 供應(yīng)商器件封裝:20-DHVQFN（4.5x 2.5） 標(biāo)準(zhǔn)包裝:3,000 |
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