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參數(shù)資料
| 型號： | 74ALVC373 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Octal D-type transparent latch 3-state |
| 中文描述： | 八路D型透明鎖存器三態(tài) |
| 文件頁數(shù)： | 15/20頁 |
| 文件大?。?/td> | 97K |
| 代理商： | 74ALVC373 |
2002 Feb 26
15
Philips Semiconductors
Product specification
Octal D-type transparent latch; 3-state
74ALVC373
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 74ALVC373BQ | 制造商:NXP Semiconductors 功能描述:IC LATCH D TYPE OCTAL DHVQFN20 制造商:NXP Semiconductors 功能描述:IC, LATCH, D TYPE, OCTAL, DHVQFN20 制造商:NXP Semiconductors 功能描述:IC, LATCH, D TYPE, OCTAL, DHVQFN20, Latch Type:D Type Transparent, Output Curren |
| 74ALVC373BQ,115 | 功能描述:閉鎖 3.3V OCTAL D-TYPE RoHS:否 制造商:Micrel 電路數(shù)量:1 邏輯類型:CMOS 邏輯系列:TTL 極性:Non-Inverting 輸出線路數(shù)量:9 高電平輸出電流: 低電平輸出電流: 傳播延遲時(shí)間: 電源電壓-最大:12 V 電源電壓-最小:5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-16 封裝:Reel |
| 74ALVC373BQ-G | 功能描述:閉鎖 3.3V OCTAL D-TYPE TRANSP LATCH RoHS:否 制造商:Micrel 電路數(shù)量:1 邏輯類型:CMOS 邏輯系列:TTL 極性:Non-Inverting 輸出線路數(shù)量:9 高電平輸出電流: 低電平輸出電流: 傳播延遲時(shí)間: 電源電壓-最大:12 V 電源電壓-最小:5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-16 封裝:Reel |
| 74ALVC373D | 功能描述:閉鎖 3.3V OCT D-TYPE TRANSP LTCH 3S RoHS:否 制造商:Micrel 電路數(shù)量:1 邏輯類型:CMOS 邏輯系列:TTL 極性:Non-Inverting 輸出線路數(shù)量:9 高電平輸出電流: 低電平輸出電流: 傳播延遲時(shí)間: 電源電壓-最大:12 V 電源電壓-最小:5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-16 封裝:Reel |
| 74ALVC373D,112 | 功能描述:閉鎖 3.3V OCT D-TYPE RoHS:否 制造商:Micrel 電路數(shù)量:1 邏輯類型:CMOS 邏輯系列:TTL 極性:Non-Inverting 輸出線路數(shù)量:9 高電平輸出電流: 低電平輸出電流: 傳播延遲時(shí)間: 電源電壓-最大:12 V 電源電壓-最小:5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-16 封裝:Reel |
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