參數(shù)資料
型號(hào)： 574402B00000G
廠商： Aavid Thermalloy
文件頁數(shù)： 68/116頁
文件大小： 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓(xùn)模塊： How to Select a Heat Sink
標(biāo)準(zhǔn)包裝： 1,000
類型： 插件板級(jí)
冷卻式包裝： TO-220
固定方法： 夾
形狀： 矩形
長度： 0.750"（19.05mm）
寬： 0.860"（21.84mm）
機(jī)座外的高度（散熱片高度）： 0.395"（10.03mm）
溫升時(shí)的功耗： 3W @ 60°C
在強(qiáng)制氣流下的熱敏電阻： 在 600 LFM 時(shí)為6°C/W
自然環(huán)境下的熱電阻： 23.2°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 002252
55
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 & TO-218 & TO-247 Heat Sinks
5330, 5331, 5332, 5333 Extruded heat sink with radial fins
Extruded heat sink with radial
fins and clip attach feature
makes device attachment easy.
Includes two solderable mounting
pins which permit vertical mount-
ing and eliminate stress on device
leads. Available in four heights for
TO-220, TO-218 and TO-247 devices.
39.10
(1.540)
6.60
(0.260)
13.50
(0.530)
25.40
(1.000)
2x
2.36
(0.093)
2x
3.96
(0.156)
3.18
(0.125)
0.64
(0.025)
"A"
"B"
NOTCH
FOR CLIP 2x
34.92
(1.375)
12.70
(0.500)
DITTIN
HIGH
X
"C"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
53310X
53300X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Material: Aluminum
Finish: Black Anodize
ORDERING INFORMATION
Part Number
Device
“A” Dim
“B” Dim
“C” Dim
533001B02551G
TO-218, TO-247
25.40 (1.000)
21.59 (0.850)
17.02 (0.670)
2.67 (0.105)
533002B02551G
TO-220
25.40 (1.000)
18.29 (0.720)
15.88 (0.625)
2.67 (0.105)
533101B02551G
TO-218, TO-247
38.10 (1.500)
21.59 (0.850)
17.02 (0.670)
2.67 (0.105)
533102B02551G
TO-220
38.10 (1.500)
18.29 (0.720)
15.88 (0.625)
2.67 (0.105)
533201B02551G
TO-218, TO-247
50.80 (2.000)
21.59 (0.850)
17.02 (0.670)
2.67 (0.105)
533202B02551G
TO-220
50.80 (2.000)
18.29 (0.720)
15.88 (0.625)
2.67 (0.105)
533301B02551G
TO-218, TO-247
63.50 (2.500)
21.59 (0.850)
17.02 (0.670)
2.67 (0.105)
533302B02551G
TO-220
63.50 (2.500)
18.29 (0.720)
15.88 (0.625)
2.67 (0.105)
Dia of PCB
Plated Thru
Hole for Pins
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—
°C/W
at
t
10
0
20
40
60
80
100
02
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
53330X
53320X
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—
°C
For additional options see page 83
CLIP 51
5304
High rise style heat sink features staggered fins and Wave-On
TM solderable mounts
High rise style heat sink features
staggered fins and Wave-On
TM
solderable mounts for easy attach-
ment to the PC card. Models include
thru holes on one side to attach
devices using standard hardware
and dittins with special slots on the
other for easy device attachment
using a convenient spring clip.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
5
0
20
40
60
80
100
0
4
8
12
16
20
4
3
1
2
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Part Number
Description
Device
“A” Dim
530401B00100G
High rise style heat sink staggered fins
TO-218, TO-247
21.08 (0.830)
4.75 (0.187)
530401B00150G
With device clip #50
TO-218, TO-247
21.08 (0.830)
4.75 (0.187)
530402B00100G
High rise style heat sink staggered fins
TO-220
18.29 (0.720)
4.75 (0.187)
530402B00150G
With device clip #50
TO-220
18.29 (0.720)
4.75 (0.187)
ORDERING INFORMATION
24.13
(0.950)
44.45
(1.750)
3.20
(0.126)
THRU
7.49
(0.295)
"A"
2.54
(0.100)
12.45
(0.490)
19.05
(0.750)
2.79
(0.110)
0.76
(0.030)
44.45
(1.750)
x
HIGH
7.62
(0.300)
10.16
(0.400)
3.00
(0.118)
4.24
(0.167)
14.99
(0.590)
3.48
(0.137)
14.99
(0.590)
1.57
(0.060)
2.54
(0.100)
DITTIN
TYP
4.06
(0.160)
12.70
(0.500)
6.60
(0.260)
30.61
(1.205)
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
CLIP 50
For additional options see page 82
Grease
Epoxy
&
page112
Grease
Epoxy
&
page112
Mounting
Kits
page 99
相關(guān)PDF資料
PDF描述
WM093I,AL WALLMNT ENCLOSURE 9.50X6.34X2.10
1-643075-4 CONN STRAIN RELIEF COVER 14POS
102536-3 CONN COVER BACK 10POS MT .100
WM093,BK WALLMNT ENCLOSURE 9.50X6.34X2.10
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574402B03200G 功能描述:散熱片 TO-220 HORZ 19.3 TR RoHS:否 制造商:Ampro By ADLINK 產(chǎn)品:Heat Sink Accessories 安裝風(fēng)格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設(shè)計(jì)目的:Express-HRR
574402B03300G 功能描述:BOARD LEVEL HEAT SINK RoHS:是 類別:風(fēng)扇，熱管理 >> 熱敏 - 散熱器 系列:- 產(chǎn)品目錄繪圖:BDN12-3CB^A01 標(biāo)準(zhǔn)包裝:300 系列:BDN 類型:頂部安裝 冷卻式包裝:分類（BGA，LGA，CPU，ASIC……） 固定方法:散熱帶，粘合劑（含） 形狀:方形，鰭片 長度:1.21"（30.73mm） 寬:1.210"（30.73mm） 直徑:- 機(jī)座外的高度（散熱片高度）:0.355"（9.02mm） 溫升時(shí)的功耗:- 在強(qiáng)制氣流下的熱敏電阻:在 400 LFM 時(shí)為6.8°C/W 自然環(huán)境下的熱電阻:19.6°C/W 材質(zhì):鋁 材料表面處理:黑色陽極化處理 產(chǎn)品目錄頁面:2681 (CN2011-ZH PDF) 其它名稱:294-1099
574404 制造商:STANNOL 功能描述:SOLDER WIRE KS100 0.5MM 250G 制造商:STANNOL 功能描述:SOLDER WIRE, KS100, 0.5MM, 250G 制造商:STANNOL 功能描述:SOLDER WIRE, KS100, 0.5MM, 250G; External Diameter - Metric:0.5mm; External Diameter - Imperial:0.02"; Solder Alloy:99, 1 Sn, Cu; Melting Temperature:227C; Weight:250g; SVHC:No SVHC (19-Dec-2012); External Diameter:0.5mm; Flux ;RoHS Compliant: Yes
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